TY  - CONF
AU  - Hefner, Allen
AU  - Shen, Z.
AU  - McClure, Ryan
AU  - Gordon, Ali
AU  - Grummel, Brian
C2  - Proceedings for the IMAPS International Conference on
High Temperature Electronics
(HiTEC 2008),  Albuquerque, NM
DA  - 2008-05-01
LA  - en
PB  - Proceedings for the IMAPS International Conference on
High Temperature Electronics
(HiTEC 2008),  Albuquerque, NM
PY  - 2008
TI  - High Temperature, High Power Module Design for Wide Bandgap Semiconductors: Packaging Architecture and Materials Considerations
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=33018
ER  -