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Projects/Programs

Displaying 26 - 34 of 34
Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Ongoing
In September 2022, NIST published a report titled Strategic Opportunities for U.S. Semiconductor Manufacturing , which cited, among other challenges, the need to understand and improve heat dissipation and performance in advanced microelectronics. Specifically, there needs to be better measurements
Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology

Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology

Ongoing
Industry roadmaps identify the characterization of nanoscale subsurface feature shape and composition as a measurement need for the semiconductor industry. However, IC interiors are difficult to probe post-manufacturing due to the presence of many close-packed and nanoscale subsurface features, of
Images depicting an advanced analysis of HR-EBSD data

Strain Measurement for Semiconductor Devices and Packages

Ongoing
Strain is a critical parameter that influences both electrical and mechanical failures of devices, however, measuring strain in complex 3D geometries and vanishingly small feature sizes remains a challenge for manufacturers. Data provided by strain measurements can be used to validate computational
Microscopy standard linking critical dimensions of line-space arrays and frustum arrays of varying pitch, for hybrid metrology by optical microscopy, scanning electron microscopy,atomic force microscopy, and the NIST line-scale interferometer

Universal Microscopy Standards

Ongoing
Microscopy standards that are available today have inadequate performance characteristics. As device linewidths decrease toward physical limits, the international roadmap of devices and systems (IRDS) has set uncertainty targets by the year 2025. This target is hard to hit, challenging the industry