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The Material Measurement Laboratory at NIST is conducting this planning workshop to identify measurement gaps that are bridgeable with electron microscopy. In this workshop, we have identified three Nationally strategic industries: Beyond CMOS computing, Additive Manufacturing, and Biological and Soft Matter validation. We will hear from these industry leaders on the most pressing metrology problems they face today, as well as problems on the horizon.
Workshop Goals:
Identify enabling measurements and resources in electron microscopy in order to strengthen Nationally strategic industries in a globally competitive market.
Background:
Electron microscopes are substantial research investments, both in terms of the tooling costs, and in the procurement and hiring lead times, particularly in the Government. The timescale for innovative solutions needed by industry often outpaces the speed of investments in our field. An evaluation of the measurement challenges in the industries where our Nation has a competitive edge is therefore essential to a microscope program’s ability to respond in a timely manner.
Abstracts for the talks below (PDF)
Wednesday - March 8, 2017
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Opening Session |
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09:00 |
NIST and MML Metrology Overview Mike Fasolka |
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09:35
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Confessions of a former microscopist: What really drives progress in science and technology Alexander H. King |
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10:25 |
Coffee break |
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10:40
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Atomic-Scale Analytical Tomography: Taking the Best from (S)TEM and Atom Probe Tom Kelly |
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11:30
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Moderated discussion |
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12:00 |
Lunch |
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Session I: Nanoelectronics and High-Performance Computing |
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13:00
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Transmission Electron Microscopy for Nanoelectronics Alain Diebold |
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13:40
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Title: Transmission Electron Microscopy for Microelectronics Reliability Brendan Foran |
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14:20 |
Coffee break + Posters |
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14:50
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Improving the Resolution, Acquisition Time and Quality of Scanning Microscopy Images Through Computational Rather Than Hardware Means Eric Lifshin |
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15:30
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Moderated discussion |
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16:30 |
Day 1 adjourn |
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17:30
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Happy hour |
Thursday - March 9, 2017
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Session II: Soft Matter Validation |
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09:00 |
Validation of CryoEM Atomic Resolution Structure Wah Chiu |
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09:40 |
Individual-Particle Electron Tomography (IPET): an approach to study flexible soft-/bio-molecular structure and dynamics Gary Ren |
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10:20 |
Coffee break |
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10:35 |
Morphology Characterization and Directing Self-Assembly in Nanostructured Soft Materials Chinedum Osuji |
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11:15 |
Moderated discussion |
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12:15 |
Lunch |
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Session III: Additive Manufacturing |
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13:30
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Electron-microscopy studies of additively manufactured 17-4PH stainless steel Rainer Hebert |
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14:10 |
The role of microscopy on ICME Methods development during the DARPA OM Program Alonso Peralta |
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14:50 |
Coffee break + Posters |
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15:20 |
Powder-Bed Additive Manufacturing Modeling and Measurement Challenges Ade Makinde |
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16:00 |
Moderated discussion and workshop conclusion |
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17:00 |
Meeting Adjourn |
Courtyard Gaithersburg Washingtonian Center
204 Boardwalk Place Gaithersburg MD 20878
$199/night (Book By February 14, 2017) Rate includes hotel shuttle to and from NIST
If you are not registered, you will not be allowed on site. Registered attendees will receive security and campus instructions prior to the workshop.
NON U.S. CITIZENS PLEASE NOTE: All foreign national visitors who do not have permanent resident status and who wish to register for the above meeting must supply additional information. Failure to provide this information prior to arrival will result, at a minimum, in significant delays (up to 24 hours) in entering the facility. Authority to gather this information is derived from United States Department of Commerce Department Administrative Order (DAO) number 207-12. When registration is open, the required NIST-1260 form will be available as well. *New Visitor Access Requirement: Effective July 21, 2014, Under the REAL ID Act of 2005, agencies, including NIST, can only accept a state-issued driver's license or identification card for access to federal facilities if issued by states that are REAL ID compliant or have an extension.Click here for a list of alternative identification and further details>>