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Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under

Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct

NIST Publishes Report on DNA Mixture Interpretation Methods

December 19, 2024

The National Institute of Standards and Technology (NIST) has published DNA Mixture Interpretation: A Scientific Foundation Review. This report reviews the

Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix to Advance U.S. Technological Leadership and Expand Capacity of Chips Crucial to the AI Supply Chain

December 19, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS

US AISI Joint Pre-Deployment Testing of OpenAI's o1

Pre-Deployment Evaluation of OpenAI's o1 Model

December 18, 2024

The U.S. Artificial Intelligence Safety Institute (US AISI) and the UK Artificial Intelligence Safety Institute (UK AISI) conducted a joint pre-deployment

Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers

December 17, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC

Left side is a photo of a firefighter dressed in full equipment, including heavy clothing, a helmet and a breathing mask. Right side is a diagram showing the three layers typically found in firefighter gear: outer shell, moisture barrier and thermal barrier.

PFAS Found in Firefighter Gloves, Hoods and Wildland Gear

December 17, 2024

The amount of PFAS in each sample varied greatly, so it may be possible to design gear that reduces exposure.

NIST Genomic Data Cybersecurity and Privacy Publications | Comment Period Open

December 16, 2024

Consumer examining bottle labels in grocery store

Best Practices for Uniform Unit Pricing: An Update to NIST SP 1181 and NIST Handbook 130 Regulations

December 13, 2024

To help shoppers everywhere get the best value for their money, the NIST Office of Weights and Measures (OWM) convened a unit price working group comprised of

Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

December 13, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT)

NIST Researchers and Collaborators Receive Best Paper Presentation Award at 2024 IEEE IECON

December 12, 2024

Dr. Martin Serrano, Amelie Gyrard, and Eoin Jordan, in collaboration with NIST researchers Eugene Song, Tom Roth, and David Wollman, received a best paper

2024 NICE K12 Cybersecurity Education Conference Recap

December 12, 2024

The NICE K12 Cybersecurity Education Conference took place this week in San Antonio, Texas. The conference brought together nearly 500 participants and featured

NIST Requests Public Comments on the SP 800-56 Subseries | Recommendations for Key Establishment

December 11, 2024

Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects and Announces Preliminary Memorandum of Terms for Virginia DRAM Project to Secure Domestic Supply of Legacy Memory Chips

December 10, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Micron Technology up to $6.165 billion in direct funding under the

2025 Baldrige Award Criteria Cover artwork

Now Announcing the 2025 Baldrige Award Criteria!

December 9, 2024

The process for the 2025 Baldrige Award, the nation’s highest recognition for excellence in organizational performance, is now underway, with the 2025 Baldrige

Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

December 6, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed three separate preliminary memoranda of terms (PMT) under the CHIPS

3 NIST Researchers Receive Presidential Rank Awards

December 5, 2024

All three were awarded the “Distinguished Rank,” the highest category of Presidential Rank Awards.

Requesting Public Comment | NIST Guidance on Implementing a Zero Trust Architecture (ZTA)

December 5, 2024

Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Material for Leading-Edge Chip Production

December 5, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program's

NIST Leaders Address the 21st International ACS/IEEE International Conference on Computer Systems and Applications in Tunisia

December 1, 2024

NIST researcher leaders Edward Griffor, Tao Zhang, and Abdella Battou addressed the 21 st International ACS/IEEE International Conference on Computer Systems

Search News and Updates

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips

Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production

NIST Publishes Report on DNA Mixture Interpretation Methods

Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix to Advance U.S. Technological Leadership and Expand Capacity of Chips Crucial to the AI Supply Chain

Pre-Deployment Evaluation of OpenAI's o1 Model

Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers

PFAS Found in Firefighter Gloves, Hoods and Wildland Gear

NIST Genomic Data Cybersecurity and Privacy Publications | Comment Period Open

Best Practices for Uniform Unit Pricing: An Update to NIST SP 1181 and NIST Handbook 130 Regulations

Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

NIST Researchers and Collaborators Receive Best Paper Presentation Award at 2024 IEEE IECON

2024 NICE K12 Cybersecurity Education Conference Recap

NIST Requests Public Comments on the SP 800-56 Subseries | Recommendations for Key Establishment

Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects and Announces Preliminary Memorandum of Terms for Virginia DRAM Project to Secure Domestic Supply of Legacy Memory Chips

Now Announcing the 2025 Baldrige Award Criteria!

Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

3 NIST Researchers Receive Presidential Rank Awards

Requesting Public Comment | NIST Guidance on Implementing a Zero Trust Architecture (ZTA)

Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Material for Leading-Edge Chip Production

Measurement Guide for Information Security | NIST Releases Volumes 1 and 2 of SP 800-55

Just for KICS!

NIST and University Researchers Present Online Tool to Support IEEE Standards at 2024 IECON

NIST Researcher and Team Present on IoT Sensor Networks at 2024 IEEE IECON

NIST Leaders Address the 21st International ACS/IEEE International Conference on Computer Systems and Applications in Tunisia

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NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
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--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
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----Integration & Policy Office
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---External R&D Partnerships Division
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----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
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----Chemical Sciences Division - HQ
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---Biomolecular Measurement Division
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----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
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---Materials Science and Engineering Division
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----Materials Science and Engineering Division - HQ
----Functional Polymers Group
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---Materials Measurement Science Division
----Security Technologies Group
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----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
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--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
----Sensor Science - HQ
----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
----Office of Weights and Measures
----Boulder Laboratory Director Office
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
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----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ