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Electronics

Semiconductors

News and Updates

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Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

November 8, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

November 1, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the first CHIPS for America R&D Flagship Facility and Planned Site for the estimated $825 Million CHIPS for America EUV Accelerator

October 31, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the

Biden-Harris Administration Opens $100 million Competition to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

October 30, 2024

Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI)

Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon

October 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary

Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

October 18, 2024

Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States

Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

October 17, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to

Biden-Harris Administration Announces Preliminary Terms with Wolfspeed to Solidify U.S. Technological Leadership in Silicon Carbide Manufacturing

October 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of

Biden-Harris Administration Announces Preliminary Terms with Edwards Vacuum to Bring Specialized Dry Vacuum Pump Manufacturing to the U.S. for the First Time

October 10, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Edwards Vacuum have signed a non-binding preliminary memorandum of

CHIPS for America Welcomes New Chair and Vice Chair to Industrial Advisory Committee (IAC)

October 8, 2024

Today, CHIPS for America announced a new Chair and Vice Chair to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on

CHIPS for America Welcomes New and Returning Members to the Industrial Advisory Committee

October 4, 2024

Today, CHIPS for America announced five new members to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on

CHIPS for America Announces Entrepreneurial Fellowships Pilot Program

October 4, 2024

Today, CHIPS for America announced a new $5 million Entrepreneurial Fellowship Pilot Program, funded by the Biden-Harris Administration's CHIPS and Science Act

Biden-Harris Administration to Invest up to $100 Million to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

October 2, 2024

Today, the U.S. Department of Commerce issued a Notice of Intent (NOI) to announce an open competition demonstrating how AI can assist in developing new

U.S. National Science Foundation and Department of Commerce Announce a New $30M Funding Opportunity, Funded by the CHIPS & Science Act, to Prepare Talent for Semiconductor Jobs Nationwide

September 27, 2024

Today, the U.S. National Science Foundation (NSF) and Department of Commerce (DOC) announced a $30 million funding opportunity, as part of the bipartisan CHIPS

CHIPS for America Releases METIS Data Exchange Ecosystem for Supporting Metrology Innovation

September 26, 2024

Today, CHIPS for America released a beta version of the Metrology Exchange to Innovate in Semiconductors (METIS) . A major milestone for the CHIPS Metrology

Biden-Harris Administration Launches NSTC Workforce Center of Excellence with Expected $250 Million Investment

September 25, 2024

Today, the Biden-Harris Administration announced the launch of the National Semiconductor Technology Center’s (NSTC) Workforce Center of Excellence (WCoE)

Biden-Harris Administration Announces First CHIPS Commercial Fabrication Facilities Award with Polar Semiconductor, Establishing Independent American Foundry

September 24, 2024

Today, as part of the Biden-Harris Administration’s Investing in America agenda, the U.S. Department of Commerce announced its first award under the CHIPS

Biden-Harris Administration Awards nearly $5 million to Small Businesses to Bring New CHIPS Technology to the Commercial Market

September 19, 2024

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, the Biden-Harris Administration awarded nearly $5 million to 17 small businesses across nine

Tiny New Lasers Fill a Long-Standing Gap in the Rainbow of Visible-Light Colors, Opening New Applications

August 28, 2024

Researchers have created orange, yellow and green lasers tiny enough to fit on a chip.

CHIPS for America Metrology Community in blue text with a blue to red gradient line

CHIPS for America Announces New CHIPS Metrology Community of Practice

August 28, 2024

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, CHIPS for America announced the establishment of a new community of practice, the CHIPS

Biden-Harris Administration Announces Preliminary Terms with HP to Support Development and Commercialization of Cutting-Edge Semiconductor Technologies

August 27, 2024

Media Contact: Hannah (Robinson) Hartranft, hannah.hartranft [at] chips.gov (hannah[dot]hartranft[at]chips[dot]gov) Today, the Biden-Harris Administration announced that the Department of Commerce and HP

Biden-Harris Administration Announces Preliminary Terms with Texas Instruments to Expand U.S. Current-Generation and Mature-Node Chip Capacity

August 16, 2024

U.S. Department of Commerce Announces Preliminary Terms with SK hynix to Advance U.S. AI Supply Chain Security

August 6, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms

Biden-Harris Administration Announces Preliminary Terms with Amkor Technology to Bring Cutting-Edge Advanced Packaging Technology to the U.S. for Leading-Edge Semiconductors

July 26, 2024

Department of Commerce and National Science Foundation partner to advance semiconductor workforce development

July 24, 2024

The U.S. National Science Foundation and the CHIPS for America Research and Development Office (CRDO) within the National Institute of Standards and Technology

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
---External & Government Affairs Division
----External & Government Affairs – HQ
---Investments Division
----Investments Division – HQ
---Operations Office
----Operations Office – HQ
---Risk Management Division
----Risk Management – HQ
---Strategy, Technology & Policy Division
----Strategy, Technology & Policy – HQ
--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
----CHIPS Research & Development Program Headquarters – HQ
----Integration & Policy Office
----Outreach & Partnerships Office
---External R&D Partnerships Division
----External R&D Partnerships – HQ
----National Advanced Packaging Manufacturing Program Group
----National Semiconductor Technology Center Group
---Industrial Advisory Committee
----Industrial Advisory Committee – HQ
---Semiconductor Manufacturing Institute Division
----Semiconductor Manufacturing Institute – HQ
---Semiconductor Metrology & Characterization Office
----Semiconductor Metrology & Characterization Office – HQ
-Management Resources
--Management Resources
---Associate Director for Management Resources
----Associate Director for Management Resources - HQ
---Business Operations Office
----Business Analytics Group
----Business Operations Office - HQ
----Customer Relationship Management Group
----Process Engineering Office
----Project Management Office
---Emergency Services Office
----Emergency Management, Preparedness and Coordination Group
----Emergency Services - HQ
----Fire Protection Group
----Security Systems and Access Control Group
---Equal Employment Opportunity and Accessibility Office
----Equal Employment Opportunity and Accessibility - HQ
---NIST Research Library and Museum
----Research Library Group
----Digital Services and Publishing Group
----NIST Research Library and Museum - HQ
---Fabrication Technology Office
----Fabrication Technology Office - HQ
--Office of Facilities and Property Management
---Boulder Design and Construction Division
----Boulder Design and Construction - HQ
----Facilities Improvement (Boulder) Group
----Reimbursable Work Group
----Facilities Modernization (Boulder) Group
---Gaithersburg Design and Construction Division
----Facilities Improvement (Gaithersburg) Group
----Reimbursable Work (Gaithersburg) Group
----Facilities Library, Archives, and As-Built (Gaithersburg) Group
----Construction Contract Management Group
----Facilities Modernization (Gaithersburg) Group
----Gaithersburg Design and Construction - HQ
---Gaithersburg Facility Maintenance Division
----Building Management (Gaithersburg) Group
----Operations Engineering Group
----Gaithersburg Facility Maintenance - HQ
----Facilities Enhancement Group
----Operations and Maintenance (Gaithersburg) Group
----Planning, Estimating and Materials Group
----Steam and Chilled Water Generation Plant Group
---Facilities Services Division
----Logistics Group
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----Site Services Group
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---Boulder Facilities Maintenance Division
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---Emergency Services Division
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----Emergency Services - HQ
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----Program Office
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--Office of Acquisition and Agreements Management
---Office of Acquisition and Agreements Management
----Administrative Support and Document Control Group
----Office of Acquisition and Agreements Management - HQ
----Policy and Compliance Group
----Reimbursable Agreements Coordination Office
---Financial Assistance Agreements Management Office
----Financial Assistance Agreements Management Office – HQ
---Acquisition Management Division
----Acquisition Management - HQ
----Acquisition Operations
----Acquisition Operations
----Acquisition Policy and Reimbursable Agreements
--Office of Information Systems Management
---Applications Systems Division
----Applications Systems - HQ
---Research Services Office
----Research Services Office - HQ
---Service Delivery Excellence Office
----Service Delivery Excellence - HQ
---Business Systems Division
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---Information Technology Security & Networking Division
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---Identity, Credential, and Access Management Division
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---Customer Access and Support Division
----Customer Access and Support - HQ
---Infrastructure Services Division
----Infrastructure Services Division - HQ
---Office of Information Systems Management
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---Innovation and Solutions Division
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---Platform Services Division
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--Office of Human Resources Management
---Learning and Organizational Development Division
----Learning and Organizational Development – HQ
---Talent Acquisition Division
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---Workforce Analytics and Technology Division
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---Human Resources Management Office
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---Workforce Programs Division
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--Office of Safety, Health and Environment
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---Gaithersburg Safety, Health and Environment Division
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----Fire and Facilities Safety Group
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---Radiation Safety Division
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----Radiation Safety - HQ
---Boulder Safety, Health and Environment Division
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--Office of Financial Resource Management
---Financial Systems and Reporting Division
----CBS Core Support Group
----CBS Feeder System Support Group
----Financial Systems and Reporting Division - HQ
----Financial Statements Group
----Data Control Group
----Reconciliations Group
---Office of Financial Resource Management
----Office of Financial Resource Management - HQ
----Internal Controls Management & Evaluation Office
----Enterprise Risk Management Office
---Finance Division
----Finance - HQ
----Financial Statements Group
----Data Control and Cost Execution Group
----Accounts Payable Purchase Orders, Grants & Foreign Payments
----Accounts Payable Contracts and Government Group
----Receivables Group
----Reconciliations Group
----Travel Group
---Financial Operations Division
----Travel Group
----Agreements Group
----Accounts Receivable Group
----Accounts Payable II Group
----Financial Operations - HQ
----Accounts Payable Group
---Budget Division
----Technical and Extramural Programs Group
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----Budget - HQ
----Formulation and Financial Management Group
-Laboratory Programs
--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
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----Guided Wave Electromagnetics Group
----Electromagnetic Fields Group
----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
----Networked Control Systems Group
----Smart Connected Manufacturing Systems Group
----Smart Grid Group
----Transformational Networks and Services Group
---Spectrum Technology and Research Division
----Applied Systems Metrology Group
----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
----Radio Access and Propagation Metrology Group
----Wireless Networks Division - HQ
----Wireless Systems Innovation and Performance Group
---Public Safety Communications Research Division
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----Advanced Communications Research Group
----Network Operations Group
---Communications Technology Laboratory HQ
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----Boulder Laboratory Director Office
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--Engineering Laboratory
---Building Energy and Environment Division
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---Intelligent Systems Division
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---Materials and Structural Systems Division
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----Infrastructure Materials Group
----Inorganic Materials Group
----Community Resilience Group
----Materials and Structural Systems - HQ
----Polymeric Materials Group
----Structures Group
---Engineering Laboratory Office
----Applied Economics Office
----Disaster Impact Reduction Office
----Engineering Laboratory - HQ
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---Fire Research Division
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----Engineered Fire Safety Group
----Fire Fighting Technology Group
---Systems Integration Division
----Life Cycle Engineering Group
----Process Engineering Group
----Information Modeling and Testing Group
----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
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----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
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---Computer Security Division
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----Security Components and Mechanisms Group
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---Applied and Computational Mathematics Division
----Mathematical Software Group
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----Quantum Information Group
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----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
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----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---Software and Systems Division
----Systems Interoperability Group
----Software Quality Group
----Software and Systems - HQ
----Cyber Infrastructure Group
----Information Systems Group
---Information Access Division
----Information Access - HQ
----Biometric Technologies Group
----Multimedia Language Technologies Group
----Information Integrity Technologies Group
----Human-Centered Technologies Group
---Information Technology Laboratory Office
----Office of Computational Science for Metrology
----Office of Emerging Technologies
----Office of IT Standardization
----Office of Government and Industrial Liaison
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Research Data and Computing Office
----Research Data and Computing Office – HQ
---Research Protections Office
----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
----Law Enforcement Standards Office
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Office of Data and Informatics
----Office of Data and Informatics - HQ
----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
----Sensor Science - HQ
----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
----Office of Weights and Measures
----Boulder Laboratory Director Office
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ