Baker, B.
, Witt, C.
, Wheeler, D.
, Josell, D.
and Moffat, T.
(2003),
Superconformal Silver Deposition using KSeCn Derivatized Substrates, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853235
(Accessed December 26, 2024)
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Superconformal Silver Deposition using KSeCn Derivatized Substrates
Published
Author(s)
, C Witt, , ,
Abstract
Superconformal filling of sub-micrometer trenches was achieved using substrates that were catalyzed with KSeCn prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was found to be dependent on the time the specimen spent in the KSeCn-containing solution prior to electrodeposition. Longer derivitization times correspond to higher initial catalyst coverages. The feature filling resullts were consistent with the Curvature Enhanced Accelerator Coverage Mechanism of superconformal deposition.Citation
Electrochemical and Solid State Letters
Volume
6
Issue
No. 5
Pub Type
Journals
Download Paper
Keywords
copper, derivitization, electrodeposition, silver, superconformal fill
Citation
Issues
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Created May 1, 2003, Updated February 17, 2017