Kreider, K.
, Ripple, D.
and Kimes, W.
(2009),
Thin-Film Resistance Thermometers on Silicon Wafers, Measurement Science & Technology, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=832220
(Accessed March 13, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Thin-Film Resistance Thermometers on Silicon Wafers
Published
Author(s)
, ,
Abstract
Thermal processing of semiconductors is a critical, capital intensive step in achieving high yields and profitability in the manufacturing of electronic chips such as ASICs and DRAMs. Many techniques have been developed to control the temperature of the silicon wafer during thermal processing. One way is to monitor the wafer surface temperature using thin-film sensors on instrumented test wafers. These sensors are also used to calibrate the lightpipe infrared thermometers used to monitor the wafer temperatures during processing. Members of the semiconductor fabrication industries have encouraged NIST to investigate the use of thin-film Pt resistance thermometers directly on the wafer to monitor temperatures during thermal processing. In particular it is proposed that we could achieve lower uncertainties for the measurement of temperature on silicon wafers being processed at 200 C to 600 C.Citation
Measurement Science & Technology
Pub Type
Journals
Download Paper
Keywords
platinum thin-films, silicon wafer temperature measurement, sputtered thin-films, temperature measurement, thin-film resistors
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created March 3, 2009, Updated February 17, 2017