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Superconformal Filling Composition and Superconformally Filling a Recessed Feature of an Article
Patent Number: 10,889,908
Abstract
Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO3)23− anions; SO32− anions; and Bi3+ cations; convectively transporting Au(SO3)23− and Bi3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO3)23− on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between −0.85 V and −1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.
Patent Description
This invention disclosure details a process for filling trenches and vias with gold for fabrication of gratings used in x-ray imaging applications. The process fills the features preferentially from the bottom, permitting seam-free and void-free filling. Gold is deposited almost exclusively within the recessed features, with minimal deposition on the field, minimizing waste and reducing post deposition processing time. The electrolyte includes no lead-based additives as well as no polymer additives. The electrolyte is non-cyanide and nearly neutral. Deposition is conducted at room temperature.
Features
Gold is deposited almost exclusively within the recessed features, with minimal deposition on the field, minimizing waste and reducing post deposition processing time. The electrolyte includes no lead-based additives as well as no polymer additives.