Moffat, T.
, Baker, B.
, Wheeler, D.
and Josell, D.
(2003),
Accelerator Aging Effects During Copper Electrodeposition, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853226
(Accessed October 31, 2024)
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Accelerator Aging Effects During Copper Electrodeposition
Published
Author(s)
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Abstract
Slow sweep rate voltammetric analysis of the Cu/Cu(II) deposition reaction is shown to be an effective tool for examining aging effects associated with thiol and disulfide additives that are widely employed as brighteners. Sulfonate-terminated short chain thiols are sponstaneiously oxidized by Cu(II) toform disulfide molecules with the conversion being complete within a few hours of electrolyte preparation. An additional aging effect occurs during electrolysis in conventional un-separated electrochemical cells. At the anode, the disulfide is reduced by Cu(I) forming thiolate cpmplexes which subsequently affect the copper deposition reaction occuring at the cathode. The latter effect may be avoided by using a cation selective membrane to isolate the anode compartment.Citation
Electrochemical and Solid State Letters
Volume
6 No. 4
Pub Type
Journals
Download Paper
Keywords
cathode, copper, sulfonate
Citation
Issues
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Created April 1, 2003, Updated February 17, 2017