Automating Thermo-Mechanical Warpage Estimation of PCBs/PCAs using a Design-Analysis Integration Framework

Published

August 18, 2006

Author(s)

Manas Bajaj, Russell Peak, Dirk Zwemer, Thomas Thurman, Lothar Klein, Giedrius Liutkus, Kevin G. Brady, John V. Messina, Mike Dickerson

Abstract

Accurate prediction, validation and reduction of thermally-induced PCB warpage are critical for enhancing manufacturing yield and reliability in time-to-market driven electronics product realization. In this paper, we describe a methodology to simulate thermally-induced warpage of PCBs and PCAs. We will demonstrate this analysis methodology using the following path: read ECAD designs from Mentor Board Station, identify features relevant to warpage analysis, create idealized analysis models, select solution technique and create solver-specific models (e.g. ANSYS models for finite-element solution), identify warpage-hotspots and calculate metrics to assist PCB/A designers in reducing warpage. We shall also present initial results from experimental verification of this technique using Shadow Moire (TherMoire) method. This methodology reuses analysis concepts, idealizations, and solution techniques for modularized and configurable simulation studies. It uses ISO 10303 technologies (STEP AP210 - www.ap210.org and Standard Data Access Interface - see www.jsdai.net).

Proceedings Title

Proceedings of the Mentor Graphics International User2User Conference

Conference Dates

May 2-5, 2006

Conference Location

San Jose, CA, USA

Conference Title

2006 Mentor Graphics International User2User

Pub Type

Conferences

Download Paper

Local Download

Keywords

AP210, Modeling, STEP, Warpage

Citation

Bajaj, M. , Peak, R. , Zwemer, D. , Thurman, T. , Klein, L. , Liutkus, G. , Brady, K. , Messina, J. and Dickerson, M. (2006), Automating Thermo-Mechanical Warpage Estimation of PCBs/PCAs using a Design-Analysis Integration Framework, Proceedings of the Mentor Graphics International User2User Conference, San Jose, CA, USA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=32287 (Accessed March 3, 2025)