Characterizing interconnects to 325 GHz

Published

November 20, 2024

Author(s)

Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff

Abstract

We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally validated our method with distributed contactless interconnects in the form of broadside coupled coplanar waveguides as a test case. We find excellent agreement between experiment, full-wave simulations, and a distributed model of contactless interconnects. This work provides a rigorous method to accurately characterize interconnects when conventional approaches are not applicable.

Citation

IEEE Transactions on Microwave Theory and Techniques

Pub Type

Journals

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Keywords

on-wafer calibration, multiline TRL, heterogeneous interconnect, broadside-coupled coplanar waveguide, distributed circuit model, de-embedding

Citation

Jungwirth, N. , Bosworth, B. , Papac, M. , Hagerstrom, A. , Marksz, E. , Cheron, J. , Stelson, A. , Bergmann, F. , Feldman, A. , Williams, D. , Long, C. and Orloff, N. (2024), Characterizing interconnects to 325 GHz, IEEE Transactions on Microwave Theory and Techniques, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936874 (Accessed January 27, 2025)