Characterizing MEMS Switch Reliability for Cryogenic Applications such as Quantum Computing

Published

July 11, 2024

Author(s)

Peter Bradley, Elizabeth Sorenson, Damian Lauria, Li-Anne Liew

Abstract

Micro Electromechanical Systems (MEMS) switches offer many advantages over conventional larger switches. One potential application we are exploring is the use of commercial radio frequency (RF) MEMS switches for quantum computing applications. However, it is well-documented that cryogenic temperatures can cause mechanical reliability issues for MEMS. Furthermore, commercial RF MEMS switches are designed for room temperature operation, thus their reliability at cryogenic temperatures is unknown. The commercial MEMS switches are also packaged inside sealed package housings, which prevent optical methods for characterization and inspection. We are therefore developing test methods to evaluate the reliability of commercial RF MEMS switches at cryogenic temperatures. We describe our test methods and preliminary reliability test data from room temperature to 55 K.

Proceedings Title

IOP Conference Series: Materials Science and Engineering, Advances in Cryogenic Engineering

Volume

1302

Conference Dates

July 9-13, 2023

Conference Location

Honolulu, HI, US

Conference Title

25th Joint Cryogenic Engineering Conference and International Cryogenic Materials Conference

Pub Type

Conferences

Download Paper

https://doi.org/10.1088/1757-899X/1302/1/012027

Local Download

Keywords

Microelectromechanical systems, MEMS, cryogenic, reliability

Citation

Bradley, P. , Sorenson, E. , Lauria, D. and Liew, L. (2024), Characterizing MEMS Switch Reliability for Cryogenic Applications such as Quantum Computing, IOP Conference Series: Materials Science and Engineering, Advances in Cryogenic Engineering, Honolulu, HI, US, [online], https://doi.org/10.1088/1757-899X/1302/1/012027, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=956325 (Accessed July 27, 2024)