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PUBLICATIONS

Chip-Scale Atomic Frequency References: Fabrication and Performance

Published

Author(s)

John Kitching, Svenja A. Knappe, Li-Anne Liew, John M. Moreland, Hugh Robinson, Peter D. Schwindt, V Shah, V Gerginov, Leo W. Hollberg

Abstract

The physics package for a chip-scale atomic frequency reference was constructed and tested. The device has a total volume of 9.5 mm3, dissipates 75 mW of electrical power at an ambient temperature of 45 °C and has a short-term fractional frequency instability of 2.4×10-10/√υ. Advanced cell fabrication techniques indicate a long-term instability near 1-^-11^ may be feasible.
Conference Location
Besancon, 1, FR
Conference Title
19th European Frequency and Time Forum
Pub Type
Conferences

Keywords

Atomic, clock, compact, microfabrication, wafer bonding
Electromagnetics

Citation

Kitching, J. , Knappe, S. , Liew, L. , Moreland, J. , Robinson, H. , Schwindt, P. , Shah, V. , Gerginov, V. and Hollberg, L. (2005), Chip-Scale Atomic Frequency References: Fabrication and Performance, 19th European Frequency and Time Forum, Besancon, 1, FR (Accessed June 30, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created November 30, 2005, Updated October 12, 2021