Russek, S.
, Lathrop, D.
, Buhrman, R.
, Moeckly, B.
and Shin, D.
(1990),
Clean grain boundaries and weak links in high T C superconducting YBa 2 Cu 3 O 7 x thin films, Applied Physics Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=905475
(Accessed December 26, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Clean grain boundaries and weak links in high T C superconducting YBa 2 Cu 3 O 7 x thin films
Published
Author(s)
, D. K. Lathrop, R A. Buhrman, Brian H. Moeckly, D. H. Shin
Citation
Applied Physics Letters
Volume
57
Pub Type
Journals
Download Paper
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created May 16, 1990, Updated February 19, 2017