Kalnas, C.
, Phelps, J.
, Marieh, T.
and Ho, A.
(2008),
Effect of modified interfaces on electromigration of passivated Al lines, Applied Physics Letters
(Accessed October 15, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Effect of modified interfaces on electromigration of passivated Al lines
Published
Author(s)
, , T N. Marieh, A Ho
Abstract
Al interconnect lines, 2.6 υm wide, 0.5 υm thick, and 300 υm long, were synthesized with modified metal/passivation interfaces. The interface modifications are discontinuous along the length of the line, enabling comparison of void formation in modified regions with unmodified regions. Lines were electromigraton tested at a current density of 2.75 x 106 A/cm2 and mean stress temperatures of 229.1degrees}C (which includes joule heating of 4.7 degrees}C) to resistance increases of 1.8 %, 4.3 % and 19.8 %. Perferential formation of voids in the modified regions was observed.Citation
Applied Physics Letters
Pub Type
Journals
Keywords
aluminum, electromigration, interconnect, modified interface
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created October 16, 2008