Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Hot-Electron Attenuation Lengths in Ultrathin Magnetic Films

Published

Author(s)

R P. Lu, B A. Morgan, K L. Kavanagh, Cedric J. Powell, P J. Chen, F Serpa, W F. Egelhoff

Abstract

Ballistic electron emission microscopy (BEEM) is used to measure hot electron transport across magnetic metal multilayers. Room temperature measurements in air have been carried out on Au/M/Si(100), Au/M/Au/Si(100) and Au/M/PtSi/Si diodes, that were sputter deposited at 175K or 300K. where M is Co, Fe, Ni, Cu or Ni81Fe19. Plots of log BEEM current versus M thickness are linear giving hot electron (1.5 eV) attenuation lengths (ALs), for Au/M/Si diodes (M - Co. Fe. Ni19. and Ni) of 0.3 nm. 0.5 nm. 0.8 nm and 1.3 nm. respectively (with typical standard uncertainties of 10%). Magnetic metal sandwich diodes. (Au/M/Au/Si) show larger ALs. 0.8 nm and 2.1 nm. for M = Co and Ni81Fe19, respectively. PtSi interlayers improve the surface roughness but have little effect on the AL while low temperature depositions increase the AL. We presume that the increases in the AL are due to better microstructure or to changes in elastic scattering at interfaces.
Citation
Journal of Applied Physics
Volume
87
Issue
No. 9

Keywords

Ballistic electron emission microscopy (, hot-electron attenuation lengths, magnetic metal multilayers, ultra-thin magnetic films

Citation

Lu, R. , Morgan, B. , Kavanagh, K. , Powell, C. , Chen, P. , Serpa, F. and Egelhoff, W. (2000), Hot-Electron Attenuation Lengths in Ultrathin Magnetic Films, Journal of Applied Physics (Accessed December 26, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created April 30, 2000, Updated October 12, 2021