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PUBLICATIONS

Lead-free Solder Alloys: NEMI Recommendation

Published

Author(s)

E -. Bradley, C A. Handwerker, J -. Sohn

Abstract

There has been substantial discussion worldwide in the electronics assembly community regarding the ideal composition for the primary lead-free alloy for use as a replacement for eutectic Sn-Pb in electronics assembly. Over the last two years, a consensus has developed that the general-purpose lead-free alloy should be from the Sn-Ag-Cu family. This article will go into some of the reasons for the NEMI alloy choice and the variations of the system relative to melting point and fraction of melted material. Microstructure and reliability results are also discussed.
Citation
Circuits Assembly
Pub Type
Journals

Keywords

circuit boards, electronics assembly, lead-free, solder

Citation

Bradley, E. , Handwerker, C. and Sohn, J. (2021), Lead-free Solder Alloys: NEMI Recommendation, Circuits Assembly (Accessed October 31, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created October 12, 2021