Microfabricated Atomic Frequency References

Published

August 23, 2004

Author(s)

Svenja A. Knappe, P Schwindt, V Shah, Leo W. Hollberg, John Kitching, Li-Anne Liew, John Moreland

Abstract

We report on the fabrication of a physics package for a chip-scale atomic clock with a volume of 9.5 mm^3, consuming 75 m W of power. The design is described in detail and is strongly motivated by the goal of wafer-level fabrication and assembly. A fractional frequency instability of 2.4 x 10-10 at one second of integration is demonstrated; the long- term drift is -2 X 10-8/day. We discuss the performance of the clock at short and long integration times as well as its power consumption, and suggest possible improvements.

Proceedings Title

Proc. IEEE Intl. Ultrasonics, Ferroelectrics, and Frequency Control Anniversary Joint Conf.

Conference Dates

August 24-27, 2004

Conference Location

Montreal, 1, CA

Conference Title

IEEE Intl. Ultrasonics, Ferroelectrics, and Frequency Control Conf.

Pub Type

Conferences

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Keywords

atomic frequency reference, chip-scale atomic clock, frequency instability, vapor cell, wafer-level integration

Citation

Knappe, S. , Schwindt, P. , Shah, V. , Hollberg, L. , Kitching, J. , Liew, L. and Moreland, J. (2004), Microfabricated Atomic Frequency References, Proc. IEEE Intl. Ultrasonics, Ferroelectrics, and Frequency Control Anniversary Joint Conf., Montreal, 1, CA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50086 (Accessed April 3, 2025)