Panoramic, Ultrawideband, Diagnostic Imaging of Test Volumes

Published

January 1, 2005

Author(s)

David R. Novotny, Robert T. Johnk, Chriss A. Grosvenor, Seturnino Canales

Abstract

This paper presents developing methodologies to assess the quality and range of use (in frequency, test volume size, and test type) of EMC test facilities. Previous efforts [1-2] have focused on transmission tests that represented typical antenna and test artifact configurations. These new tests illuminate a facility and measure the reflections from scattering objects and residual RF ringing to determine modal and basic propagation characteristics. Joint Time- and Frequency-Domain analysis (JTFA) of the measurements allow for characterization of the signals in various categories such as broad- or narrow-band scatterers, leakage, or systematic facility ringing. These directional measurements allow isolation in space and time to allow for location of facility irregularities. The initial results that are presented show scatterers intentionally placed in the Time-Domain, Free-Field Metrology Laboratory. These artifacts were imaged and identified in time, space and frequency. This panoramic, ultrawideband, reflection measurement takes a full 360' sweep of the facility and uses JTFA tools to identify specific scatterers and other irregularities in the facility. Combinations of horizontal- and vertical- polarization sweeps show improved Signal-to-Noise (SNR) and can highlight polarization sensitive events. This fast testing technique, 3 hours for a 10 MHz to 2 GHz dual polarization sweep with a range of 120m and resolution of less than 30 cm, can be used as a pre-compliance check and determine the RF performance of a EM facility.

Conference Dates

August 9-13, 2004

Conference Location

Santa Clara, CA, USA

Conference Title

IEEE International Symposium on EMC

Pub Type

Conferences

Keywords

EMC, FAR, OATS, Time-Domain

Citation

Novotny, D. , Johnk, R. , Grosvenor, C. and Canales, S. (2005), Panoramic, Ultrawideband, Diagnostic Imaging of Test Volumes, IEEE International Symposium on EMC, Santa Clara, CA, USA (Accessed November 23, 2024)