Wheeler, D.
, Josell, D.
, Warren, J.
and Wallace, W.
(2002),
Prediction of Lateral and Normal Force-Displacement Curves for Flipchip Solder Joints, Computational Modeling of Materials, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853873
(Accessed January 9, 2025)
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Prediction of Lateral and Normal Force-Displacement Curves for Flipchip Solder Joints
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Conference Title
Computational Modeling of Materials
Pub Type
Conferences
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Keywords
Electronic Materials, Flipchip, Simulations & Modeling, Solder, Surface Evolver, Thermal Properties, underfill
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Created January 1, 2002, Updated February 17, 2017