October 16, 2008
Author(s)
C A. Handwerker, E E. de Kluizenaar, K Suganuma, Frank W. Gayle
Beginning in 1991, the microelectronics community worldwide became increasingly aware of the possibility of being required, by law, by tax, or by market pressure, to replace tin-lead eutectic solders in electronic assemblies. Over the ten years that