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Search Publications by: Martin Y. M. Chiang (Assoc)

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Displaying 51 - 75 of 126

Combinatorial and High-Throughput Measurement of the Modulus of Thin Polymer Films

June 1, 2005
Author(s)
Christopher M. Stafford, Shu Guo, Martin Y. Chiang, C Harrison
Considerable attention has been devoted to developing fabrication strategies for constructing combinatorial material libraries as well as tools for characterizing the chemical and physical properties of such libraries. Less attention has been dedicated to

Combinatorial Peel Tests for the Characterization of Adhesion Behavior of Polymeric Films

February 1, 2005
Author(s)
R Song, Martin Chiang, A J. Crosby, Alamgir Karim, Eric J. Amis, Naomi Eidelman
The self-adhesion behavior of an optically smooth poly(methyl methacrylate) (PMMA) thin film (ca.. 100 nm) on different evaporated metal substrates has been investigated using a combinatorial method approach. In this investigation through high-throughput

Combinatorial Approaches for Characterizing Thin Film Bond Strength

January 1, 2005
Author(s)
Martin Chiang, D Kawaguchi, Christopher Stafford
A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a

Elastic Instability of Multilayer Films Coated on Substrates

January 1, 2005
Author(s)
Shu Guo, Martin Y. Chiang, Christopher M. Stafford
Mechanical properties of ultra-thin (submicrometer) films coated on a substrate are paramount in many applications. One question arises as to whether the physical and mechanical properties of supported thin films in applications can be significantly

High-Throughput Modulus Measurements of Ultra-Soft Polymer Networks

January 1, 2005
Author(s)
Elizabeth A. Wilder, Shu Guo, Martin Chiang, Christopher Stafford
A metrology for rapidly measuring the modulus of ultra-soft polymer networks has been developed. The method utilizes compression-induced buckling of a sensor film that is applied to the surface of the specimen, where the modulus-dependent buckling

Stress Analysis for Combinatorial Buckling-Based Metrology of Thin Film Modulus

January 1, 2005
Author(s)
Shu Guo, Christopher M. Stafford, Martin Y. Chiang
We recently reported on a new buckling-based metrology for probing the elastic modulus of thin polymer films. In this experimental geometry, a thin film of interest is transferred to a relatively thick elastic substrate, and buckling is induced by