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Search Publications by: John V. Messina (Fed)

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Displaying 26 - 42 of 42

Focus 3D Telemodeling Tool: GUI Design for Iteration 1

September 28, 2006
Author(s)
Matthew L. Aronoff, John V. Messina, Eric D. Simmon
The Focus 3D Telemodeling Tool was designed as a novel graphical interface to data modeling for standards development. This paper describes the design intent for the proposed Graphical User Interface (GUI) of Focus -- how users interact with the system and

Automating Thermo-Mechanical Warpage Estimation of PCBs/PCAs using a Design-Analysis Integration Framework

August 18, 2006
Author(s)
Manas Bajaj, Russell Peak, Dirk Zwemer, Thomas Thurman, Lothar Klein, Giedrius Liutkus, Kevin G. Brady, John V. Messina, Mike Dickerson
Accurate prediction, validation and reduction of thermally-induced PCB warpage are critical for enhancing manufacturing yield and reliability in time-to-market driven electronics product realization. In this paper, we describe a methodology to simulate

Focus: Augmented Reality for Standards Development

April 1, 2006
Author(s)
Matthew L. Aronoff, John V. Messina
The next generation of Product Data Exchange (PDE) standards will require the active participation of domain experts in the standards development process. Due to geographical separation and a lack of the XML expertise required to develop a high-quality

Migrating Legacy Data in the PCB Industry

April 1, 2006
Author(s)
Matthew L. Aronoff, John V. Messina
The printed circuit board (PCB) industry has been using the Gerber (RS-274) file format for decades, resulting in a substantial library of legacy designs. One of the main drawbacks of the Gerber format is that it does not convey design intent. In order to

GerberTranslator: Moving towards new PCB standards

September 28, 2005
Author(s)
Matthew L. Aronoff, John V. Messina
This paper describes the key features of the NIST-developed software tool called ?GerberTranslator?. GerberTranslator is a software translator which automates the majority of the work in converting a printed circuit board (PCB) described in the industry

Simple UML Modeling to Improve the Development of Information Standards

September 24, 2005
Author(s)
Eric D. Simmon, John V. Messina, Arthur Griesser
Streamlining and Bulletproofing the Standards Development Process In the increasingly complex semiconductor fabrication environment capturing and transferring information throughout the product development cycle is critical. As the process of creating

GerberTranslator: Moving towards new PCB standards

August 29, 2005
Author(s)
Matthew L. Aronoff, John V. Messina
This paper describes the key features of the NIST-developed software tool called ?GerberTranslator?. GerberTranslator is a software translator which automates the majority of the work in converting a printed circuit board (PCB) described in the industry

Software Interoperability: Enabling New Technologies

May 19, 2005
Author(s)
John V. Messina, Matthew L. Aronoff, Eric D. Simmon
New and potentially disruptive technologies are constantly being introduced into the electronic interconnection industry as companies seek to improve their manufacturing chain and stay competitive. These new technologies do not exist in a vacuum and must

Next Generation Simulation-based Design Technologies for Electronics Product Realization

May 1, 2005
Author(s)
Manas Bajaj, Dirk Zwemer, Russell Peak, Mike Dickerson, Thomas Thurman, Kevin G. Brady, John V. Messina
The realm of electronics product realization is marked by an extremely fast-paced market, stringent demands for product reliability and high importance to innovative design. Further, the time-to-market and the cost-to-realize play a critical role for

PWB Warpage Analysis and Verification using an AP210 Standards-based Engineering Framework and Shadow Moire

March 10, 2004
Author(s)
Dirk Zwemer, Manas Bajaj, Russell Peak, Thomas Thurman, Kevin G. Brady, S McCarron, A Spradling, Mike Dickerson, Lothar Klein, Giedrius Liutkus, John V. Messina
Thermally induced warpage of printed wiring boards (PWB) and printed circuit assemblies (PCA) is an increasingly important issue in managing the manufacturing yield and reliability of electronic devices. In this paper, we introduce complementary simulation

From Databooks to Online Dictionaries and Parts Catalogues

January 5, 2004
Author(s)
John V. Messina, James A. St Pierre
This power point presentation was presented at the 4th Annual ECCMA Membership Conference at Lehigh University on October 22nd, 2003 during a panel presentation on competitive sourcing, parts interoperability, and inventory visibility in public sector

From Databooks to Online Dictionaries and Parts Catalogues

October 27, 2003
Author(s)
John V. Messina, James A. St Pierre
This power point presentation was presented at the 4th Annual ECCMA Membership Conference at Lehigh University on October 22nd, 2003 during a panel presentation on competitive sourcing, parts interoperability, and inventory visibility in public sector

Design and Development of a Dictionary Translator

January 1, 1999
Author(s)
John V. Messina, James A. St Pierre, Michael R. McCaleb
The lack of a traceable set of terminologies to describe electronic components has long been identified by the electronic industry as a significant problem. As part of its Electronic Commerce of Component Information (ECCI) project, NIST's Electronic