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Search Publications by: Gery R. Stafford (Assoc)

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Displaying 76 - 100 of 151

Nanotwin formation and its physical properties and effect on reliability of copper interconnects.

May 3, 2008
Author(s)
Di Xu, Vinay Sriram, Vidvuds Ozolins, Jenn-Ming Yang, K. N. Tu, Gery R. Stafford, Carlos R. Beauchamp, Inka Zienert, Holm Geisler, Petra Hofmann, Ehrenfried Zschech
Ultra-fine grained copper with a large amount of nano-scale twin boundaries has high mechanical strength and maintain normal electrical conductivity. The combination of these properties may lead to promising applications in future Si microelectronic

Aluminum UPD and Alloy Formation on (111)-Textured Au in AlCl_{3}-EMImCl

March 20, 2008
Author(s)
Gery R. Stafford, G Haarberg
The kinetics of Al-Au surface alloy formation was examined during Al underpotential deposition (upd) onto (111)-texture Au from Lewis acidic aluminum chloride-1-ethyl-3-methlimidazolium chloride (AlCl_{3}-EMImCl)using linear sweep stripping voltammetry

Equi-Axed Grain Formation in Electrodeposited Sn-Bi

December 29, 2007
Author(s)
E Sandnes, Maureen E. Williams, Mark D. Vaudin, Gery R. Stafford
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity and corrosion resistance. However, Sn whiskers have been observed to grow spontaneously from Sn electrodeposits and

Electrodeposition of Bismuth From Nitric Acid Electrolyte

April 2, 2007
Author(s)
E Sandnes, Maureen E. Williams, Ugo Bertocci, Mark D. Vaudin, Gery R. Stafford
The electrodeposition of Bi from acidic nitrate solution was examined. Bismuth deposition was determined to be quasi-reversible on Au, with a current efficiency of 100%, based on integration of deposition and stripping voltammetric waves. No interference