U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications by: Kil-Won Moon (Fed)

Search Title, Abstract, Conference, Citation, Keyword or Author
Displaying 26 - 50 of 63

Whisker Formation in Pb-Free Surface Finishes

February 2, 2010
Author(s)
Gery R. Stafford, Maureen E. Williams, Jae W. Shin, Kil-Won Moon, William J. Boettinger, Carlos R. Beauchamp
Tin(Sn)-lead(Pb) alloys have been used extensively for surface finishing of electronic components in part because Pb was found to be effective in retarding Sn whisker growth in electrodeposits. Altough whiskers appear to be a local response to the

Alloy Selection

October 16, 2008
Author(s)
C A. Handwerker, Ursula R. Kattner, Kil-Won Moon, J Bath, E -. Bradley, P Snugovsky
In this chapter, the key results and analyses leading to the choice of tin-silver-copper alloys by NEMI as the new national standard Pb-free solder system are discussed in detail. These include data on phase transformations in solders (including melting

Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic

October 16, 2008
Author(s)
Maureen E. Williams, Kil-Won Moon, William J. Boettinger, Daniel Josell
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To

The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders

October 16, 2008
Author(s)
Kil-Won Moon, Ursula R. Kattner, C A. Handwerker
This paper presents experimental results and theoretical calculations that evaluate the effects of Bi contamination on the solidification behavior of Sn-Pb alloys. The pasty (mushy) range, the type of solidification path, and the microstructure of the

Whisker Formation in Pb-Free Surface Finishes

September 11, 2006
Author(s)
Gery R. Stafford, Maureen E. Williams, C E. Johnson, Kil-Won Moon, Ugo Bertocci, William J. Boettinger
High purity bright Sn, Sn-Cu and Sn-Pb layers measuring 3,7 and 16 microns thick were electrodeposited onto phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min. of plating proved that all

Whisker & Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits

November 11, 2005
Author(s)
William J. Boettinger, C E. Johnson, Leonid A. Bendersky, Kil-Won Moon, Maureen E. Williams, Gery R. Stafford
Bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 mm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Over a period of several days, Sn-Cu deposits develop 50 mm contorted hillocks and 200 mm whiskers, pure Sn

Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders

September 11, 2005
Author(s)
Kil-Won Moon, C E. Johnson, Maureen E. Williams, O Kongstein, Gery R. Stafford, C A. Handwerker, William J. Boettinger
To evaluate the effects of the oxide film on Sn whisker growth, a bright Sn-Cu electrodeposit was tested in an ultrahigh vacuum chamber with Auger analysis. After Ar+ ion beam cleaning to remove the oxide film, the sample was analyzed and stored in the