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Search Publications by: Richard M. Silver (Fed)

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Displaying 101 - 125 of 307

3-D Optical Metrology of Finite sub-20 nm Dense Arrays using Fourier Domain Normalization

March 25, 2013
Author(s)
Jing Qin, Hui Zhou, Bryan M. Barnes, Ronald G. Dixson, Richard M. Silver
Reduced target dimensions requiring improved resolution and sensitivity have driven the need to use and analyze the phase and scattered frequency information available when using image-based scatterometry systems. One such system is scatterfield microscopy

Topography Measurements and Performance Comparisons between NIST SRM 2460 Standard Bullet Masters and BKA Bullet Replicas

July 31, 2012
Author(s)
Jun-Feng Song, Theodore V. Vorburger, Robert M. Thompson, Susan M. Ballou, Xiaoyu Alan Zheng, Thomas Brian Renegar, Richard M. Silver
Two Standard Reference Material (SRM) 2460 Bullets produced by the National Institute of Standards and Technology (NIST) were used as masters for the fabrication of replica bullets at the Bundeskriminalamt (BKA). The surface topography of the SRM masters

On CD-AFM bias related to probe bending

April 9, 2012
Author(s)
Vladimir A. Ukraintsev, Ndubuisi George Orji, Theodore V. Vorburger, Ronald G. Dixson, Joseph Fu, Richard M. Silver
Critical Dimension AFM (CD-AFM) is a widely used reference metrology. To characterize modern semiconductor devices, very small and flexible probes, often 15 nm to 20 nm in diameter, are now frequently used. Several recent publications have reported on

Scatterfield Microscopy of 22 nm Node Patterned Defects using Visible and DUV Light

April 4, 2012
Author(s)
Bryan M. Barnes, Martin Y. Sohn, Francois R. Goasmat, Hui Zhou, Richard M. Silver, Abraham Arceo
Smaller patterning dimensions and novel architectures are fostering research into improved methods of defect detection in semiconductor device manufacturing. This initial experimental study, augmented with simulation, evaluates scatterfield microscopy to

Development of Ballistics Identification - From Image Comparison to Topography Measurement in Surface Metrology-

March 22, 2012
Author(s)
Jun-Feng Song, Theodore V. Vorburger, Robert M. Thompson, Thomas Brian Renegar, Xiaoyu Alan Zheng, James H. Yen, Richard M. Silver, Wei Chu
Fired bullets and ejected cartridge cases have unique ballistics signatures left by the firearm. By analyzing the ballistics signatures, forensic examiners can trace these bullets and cartridge cases to the firearm used in a crime scene. Current automated

The National Ballistics Imaging Comparison (NBIC) Project

March 10, 2012
Author(s)
Jun-Feng Song, Theodore V. Vorburger, Susan M. Ballou, Robert M. Thompson, James H. Yen, Thomas Brian Renegar, Xiaoyu Alan Zheng, Richard M. Silver, Martin Ols
In response to the guidelines issued by the ASCLD/LAB-International (American Society of Crime Laboratory Directors/Laboratory Accreditation Board) to establish traceability and quality assurance in U.S. crime laboratories, a NIST/ATF joint project

Nanometrology Using Through-Focus Scanning Optical Microscopy Method

December 21, 2011
Author(s)
Ravikiran Attota, Richard M. Silver
We present an initial review of a novel through-focus scanning optical microscopy (TSOM) imaging method that produces nanometer dimensional measurement sensitivity using a conventional bright-field optical microscope. In the TSOM method a target is scanned

Fundamental Limits of Optical Patterned Defect Metrology

November 14, 2011
Author(s)
Richard M. Silver, Bryan Barnes, Martin Sohn, Hui Zhou, Jing Qin
The semiconductor manufacturing industry is now facing serious challenges in achieving defect detection rates with acceptable throughput and accuracy. With conventional bright-field and dark-field inspection methods now at their limits, it has become