Publications

Displaying 101 - 125 of 269

Full elastic strain and stress tensor measurements from individual dislocation cells in copper through-Si vias

September 30, 2015

Author(s)

Lyle E. Levine, Chukwudi A. Okoro, Ruqing Xu

We report non-destructive measurements of the full elastic strain and stress tensors from individual dislocation cells distributed along the full extent of a 50 m long polycrystalline copper via in Si. Determining all of the components of these tensors

Characterization of Nickel Based Superalloys Processed Through Direct Metal Laser Sintering Technique of Additive Manufacturing

August 3, 2015

Author(s)

Yaakov S. Idell, Carelyn E. Campbell, Lyle E. Levine, Fan Zhang, Andrew J. Allen, Greg Olson, David Snyder

Characterization of Nickel Based Superalloys Processed Through Direct Metal Laser Sintering Technique of Additive Manufacturing

June 29, 2015

Author(s)

Yaakov S. Idell, Carelyn E. Campbell, Lyle E. Levine, Eric Lass, Li Ma, Sudha Cheruvathur

Additive manufacturing of nickel based superalloys will allow direct production of complex shaped components based on 3-D computer aided drawings. The aerospace industry is interested in exploiting this technology to reduce time and cost for production of

Experimental Measurement of the Effect of Copper Through-Silicon Via Diameter on Stress Buildup Using Synchrotron-based X-ray Source

June 20, 2015

Author(s)

Chukwudi A. Okoro, Lyle E. Levine, Yaw S. Obeng, Ruqing Xu

In this work, the effect of Cu through-silicon via (TSV) diameter on stress buildup in Cu TSVs was experimentally determined using synchrotron-based X-ray microdiffraction technique. With the aid of atomic force microscopy (AFM), Cu protrusion was also

Experimentally, How Does Cu TSV Diameter Influence its Stress State?

May 27, 2015

Author(s)

Chukwudi A. Okoro, Lyle E. Levine, Yaw S. Obeng, Ruqing Xu

In this work, an experimental study of the influence of Cu through-silicon via (TSV) diameter on stress build up was performed using synchrotron-based X-ray microdiffraction technique. Three Cu TSV diameters were studied; 3 µm, 5 µm and 8 µm, all of which

Simultaneous multiplexed materials characterization using a high-precision hard-X-ray micro-slit array

May 1, 2015

Author(s)

Fan Zhang, Andrew J. Allen, Lyle E. Levine, Derrick C. Mancini, Jan Ilavsky

The needs both for increased experimental throughput and for in-operando characterization of functional materials under increasingly realistic experimental conditions have emerged as major challenges across the whole of crystallography. Aiming to address

Sensitivity of gold nano conductors to voids, substitutions and electric field: ab initio results

January 16, 2015

Author(s)

Francesca M. Tavazza, Shmuel Barzilai, Lyle E. Levine

Gold nanowires are good candidates for nanoelectronics devices. A previous study has shown that the beryllium terminated BeO (0001) surface may be a useful platform for supporting nano gold conductors, since it preserves the nano-wire configuration and

X-Ray microbeam measurements of long range internal stresses in commercial purity aluminum processed by multiple passes of equal-channel angular pressing

December 15, 2014

Author(s)

Lyle E. Levine, Thien Phan, I-Fang Lee, Jonathan Z. Tischler, Huang Yi, Alan G. Fox, Terrance G. Langdon, Mike Kassner

X-ray microbeam diffraction was used to measure long range internal stresses (LRIS) in the grain/subgrain interiors of commercial purity aluminum processed by equal-channel angular pressing for up to 8 passes. The LRIS values at +4.9o off the axial

Structural and Dynamical Studies of Acid Mediated Conversion in Amorphous-Calcium-Phosphate Based Dental Composites

October 31, 2014

Author(s)

Fan Zhang, Andrew Allen, Lyle E. Levine, Mark D. Vaudin, Drago Skrtic, Joseph M. Antonucci, Kathleen Hoffman, Anthony A. Giuseppetti, Jan Ilavsky

Amorphous calcium phosphate (ACP) based composites are promising restorative dental materials attributable to ACP's capacity to release calcium and phosphate ions through a complex reaction in which ACP is converted to its crystalline, apatitic form

Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction

July 1, 2014

Author(s)

Chukwudi A. Okoro, Lyle E. Levine, Yaw S. Obeng, Klaus Hummler, Ruqing Xu

In this study, we report a new method for achieving depth resolved determination of the full stress tensor in buried Cu through-silicon vias (TSVs), using synchrotron based X-ray micro-diffraction technique. Two adjacent Cu TSVs were analyzed; one capped

Unveiling the Origin of a Nonequilibrium Dynamic Process Detected by X-Ray Photon Correlation Spectroscopy via a Finite Element Analysis Approach

July 1, 2014

Author(s)

Li Ma, Fan Zhang, Andrew J. Allen, Lyle E. Levine

It is a scientific and engineering challenge to characterize materials under nonequilibrium conditions. In recent years, X-ray photon correlation spectroscopy (XPCS), a synchrotron based coherent X-ray scattering technique, has been found useful in

Synchrotron-Based Measurement of the Impact of Thermal Cycling on the Evolution of Stresses in Cu Through-Silicon Via

June 30, 2014

Author(s)

Chukwudi A. Okoro, Lyle E. Levine, Ruqing Xu, Klaus Hummler, Yaw S. Obeng

One of the main causes of failure during the lifetime of microelectronics devices is their exposure to fluctuating temperatures. In this work, synchrotron-based X-ray micro-diffraction is used to study the evolution of stresses in copper through-silicon

Designing a Uniaxial Tension/Compression Test for Springback Analysis in High-Strength Steel Sheet

June 16, 2014

Author(s)

Mark R. Stoudt, Lyle E. Levine, Li Ma

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