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Search Publications by: Hae-Jeong Lee (Fed)

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Displaying 26 - 50 of 78

Investigation of N 2 Plasma Effects on the Depth Profile of Hydrogen Silsesquioxane Thin Films Using High Resolution Specular X-Ray Reflectivity

October 16, 2008
Author(s)
Hae-Jeong Lee, Eric K. Lin, J K. Lan, Y L. Cheng, H C. Liou, Wen-Li Wu, Y L. Wang, M S. Feng, C G. Chao
Non-destructive, specular X-ray reflectivity (SXR) measurements were used to investigate N2 plasma effects on the density depth profile of hydrogen silsesquioxane (HSQ) thin films. The SXR data indicate that the density profile of an HSQ film without

Characterization of Laminin on Silanized Polydimethylsiloxane

August 21, 2008
Author(s)
Joy P. Dunkers, Lisa M. Hughes, Hae-Jeong Lee, Marvi Matos, Marcus T. Cicerone
In this work, we characterize a protein surface on a flexible polydimethylsiloxane substrate (PDMS) capable of undergoing strain. We compare the results from two different surface treatments: physically adsorbed laminin on PDMS and laminin deposited on

Self-Sealing Nanoporous Low-k Dielectric Patterns Created by Nanoimprint Lithography

April 15, 2008
Author(s)
Hyun Wook Ro, H Peng, Ken-ich Nihara, Hae-Jeong Lee, Eric K. Lin, Alamgir Karim, D Gidley, Hiropshi Jinai, Do Y. Yoon, Christopher L. Soles
In this letter we describe how highly porous nanostructures can be directly printed into a poly(methylsilsequioxane) (PMSQ)-based organosilicate film, with high pattern fidelity, and develop the measurement infrastructure to quantitatively evaluate the

Characterizing Pattern Structures Using X-Ray Reflectivity

March 28, 2008
Author(s)
Hae-Jeong Lee, Christopher L. Soles, Hyun Wook Ro, Shuhui Kang, Eric K. Lin, Alamgir Karim, Wen-Li Wu
Specular X-ray reflectivity (SXR) can be used, in the limit of the effective medium approximation (EMA), as a high-resolution shape metrology for periodic patterns on a planar substrate. The EMA means that the density of the solid pattern and the space

The Direct Patterning of Nanoporous Interlayer Dielectric Insulator Films by Nanoimprint Lithography

October 2, 2007
Author(s)
Hyun Wook Ro, Ronald L. Jones, H Peng, Daniel R. Hines, Hae-Jeong Lee, Eric K. Lin, Alamgir Karim, Do Y. Yoon, D Gidley, Christopher L. Soles
Directly patterning dielectric insulator materials via nanoimprint lithography has the potential to simplify fabrication processes and significantly reduce the manufacturing costs for semiconductor devices. However, the prospect of mechanically forming

Mechanically Robust Spin-On Organosilicates Glasses for Nanoporous Applications

February 7, 2007
Author(s)
Hyun Wook Ro, K Char, Eun-Chae Jeon, H C. Kim, Dongil Kwon, Hae-Jeong Lee, J. H. Lee, Hee-Woo Rhee, Christopher L. Soles, Do Y. Yoon
An increasing number of technologies demand nanoporous materials with vastly improved physical, mechanical and thermal properties. This manuscript develops the microstructural basis for synthesizing organosilicate glasses (OSGs) with unprecedented thermal

Evidence for Internal Stresses Induced by Nanoimprint Lithography

November 30, 2006
Author(s)
Hyun Wook Ro, Yifu Ding, Hae-Jeong Lee, Daniel R. Hines, Ronald L. Jones, Eric K. Lin, Alamgir Karim, Wen-Li Wu, Christopher L. Soles
The thermal embossing form of nanoimprint lithography is used to pattern arrays of nanostructures into several different polymer films. The shape of the imprinted patterns is characterized with nm precision using both X-ray scattering and reflectivity

Structural Characteristics of Methylsilsesquioxane Based Porous Low-k Thin Films Fabricated with Increasing Cross-Linked Particle Porogen Loading

September 1, 2006
Author(s)
Hae-Jeong Lee, Christopher L. Soles, Da-Wei Liu, Barry J. Bauer, Eric K. Lin, Wen-Li Wu
Methylsilsesquioxane (MSQ) based porous low-k dielectric films with different porogen loading have been characterized using X-ray porosimetry (XRP) to determine their pore size distribution, average density, wall density and porosity. By varying the