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Search Publications by: Daniel Wheeler (Fed)

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Displaying 26 - 50 of 53

An Exact, Algebraic Solution for the Incubation Period of Superfill

January 1, 2004
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Recent publications have used the impact of area change coupled with conservation of adsorbed catalyst to quantify the superfill effect of bottom-up feature filling during electrodeposition and chemical vapor deposition. This work describes how that

Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

August 4, 2003
Author(s)
Daniel Josell, Daniel Wheeler, C Witt, Thomas P. Moffat
Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on

Influence of a Catalytic Surfactant on Roughness Evolution During Film Growth

July 24, 2003
Author(s)
Daniel Wheeler, Thomas P. Moffat, Geoffrey B. McFadden, Sam R. Coriell, Daniel Josell
celerator Coverage (CEAC) based mechanism for the impact of additives on the evolution of surface roughness is explained; the CEAC mechanism accounts for the conservation of locl coverage of adsorbed catalyst on a deforming interface. It has recently been

Modeling Superconformal Electrodeposition Using the Level Set Method

May 1, 2003
Author(s)
Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Superconformal filling (superfill) occurs when a high aspect ratio feature on a silicon wafer fills due to preferential metal deposition on the bottom surface that permits it to escape before deposition on the side walls causes them to close off. This

Superconformal Silver Deposition using KSeCn Derivatized Substrates

May 1, 2003
Author(s)
B C. Baker, C Witt, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Superconformal filling of sub-micrometer trenches was achieved using substrates that were catalyzed with KSeCn prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was found to be dependent on the time the

Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor

April 3, 2003
Author(s)
Daniel Josell, S D. Kim, Daniel Wheeler, Thomas P. Moffat, S G. Pyo
The mechanism behind superconformal filling of fine features during surfactant catalyzed chemical vapor deposition is described and the metrology required to predict it is identified and quantified. The impact of adsorbed iodine coverage on copper

Accelerator Aging Effects During Copper Electrodeposition

April 1, 2003
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, Daniel Josell
Slow sweep rate voltammetric analysis of the Cu/Cu(II) deposition reaction is shown to be an effective tool for examining aging effects associated with thiol and disulfide additives that are widely employed as brighteners. Sulfonate-terminated short chain

Superconformal Electrodeposition of Silver from a KAg(CN) 2 -KCN-KSeCN Electrolyte

February 1, 2003
Author(s)
B C. Baker, M Freeman, B Melnick, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Electrodeposition of silver from a KAg(CN) 2-KCN electrolyte was investigated. The addition of potassium selenocyanate (KSeCN) results in a hysteretic current-voltage response, specular films and superconformal growth in submicrometer vias. These

A Mechanism for Brightening: Linear Stability Analysis of the Curvature Enhanced Coverage Model

January 6, 2003
Author(s)
Geoffrey B. McFadden, Sam R. Coriell, Thomas P. Moffat, Daniel Josell, Daniel Wheeler, W Schwarzacher
This work presents experiments and theory describing a mechanism for how brighteners in electrolytes function. The mechanism involves change of local coverage of a deposition rate enhancing catalyst adsorbed on the surface through change of local surface

Superconformal Electrodeposition Using Derivitized Substrates

December 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, C Witt, Daniel Josell
This paper demonstrates superconformal electrodeposition of copper in trenches using a two step process. The substrate is first derivitized with a submonolayer coverage of catalyst and then transferred for electroplating in a cupric sulfate electrolyte

Superconformal Film Growth

October 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
Superconformal electrodeposition of copper is explained by the recently developed curvature enhanced accelerator coverage (CEAC) mechanism. The model stipulates that 1. the growth velocity is proportional to the local accelerator, or catalyst, surface

Superconformal Electrodeposition of Silver in Submicrometer Features

August 1, 2002
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, John E. Bonevich, Monica D. Edelstein, D R Kelly, L Gan, Gery R. Stafford, P J. Chen, William F. Egelhoff Jr., Daniel Josell
The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyanide

Electrodeposition of Silver in Sub-Micron-Sized Features

February 1, 2002
Author(s)
B C. Baker, Thomas P. Moffat, Daniel Josell, Daniel Wheeler
Successful superfilling of lines and vias will be shown with a commercial, silver-cyanide electrolyte. Hysteretic i-V behavior and chronoamperometric transients on planar electrodes are used to extract parameters that quantify the kinetics of the

Superconformal Deposition by Surfactant-Catalyzed Chemical Vapor Deposition

January 24, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
The curvature enhanced accelerator coverage (CEAC) mechanism recently proposed to explain superconformal filling of fine trenches during copper electrodeposition is shown to also explain superconformal filling and roughness evolution during iodine

Superconformal Electrodeposition in Vias

January 1, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator coverage mechanism to model the effect of accelerator accumulation and area change on local copper deposition rate. Superconformal

Prediction of Lateral and Normal Force-Displacement Curves for Flipchip Solder Joints

September 1, 2001
Author(s)
Daniel Wheeler, Daniel Josell, James A. Warren, William E. Wallace
We present the results of experiments and modeling of flip-chip geometry solder joint shapes under shear loading. Modeling, using Surface Evolver, included development of techniques that use an applied vector force (normal and shear loading) as input to

Superconformal Electrodeposition in Submicron Features

July 1, 2001
Author(s)
Daniel Josell, Daniel Wheeler, W H. Huber, Thomas P. Moffat
Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local