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Search Publications by: David A. Wollman (Fed)

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Displaying 76 - 100 of 150

Microfabricated Transition-Edge X-ray Detectors

March 1, 2001
Author(s)
Gene C. Hilton, John M. Martinis, Kent D. Irwin, Norman F. Bergren, David A. Wollman, Martin Huber, Sae Woo Nam
We are developing high performance x-ray detectors based on superconducting transition-edge sensors (TES) for application in materials analysis and astronomy. Using our recently developed fully lithographic TES fabrication process, we have made devices

Transition Edge Sensor Array Development

March 1, 2001
Author(s)
Steven Deiker, James A. Chervenak, Gene C. Hilton, Kent D. Irwin, John M. Martinis, Sae Woo Nam, David A. Wollman
NIST is fabricating multi-pixel arrays of our transition edge sensor (TES) microcalorimeter detectors for use in microanalysis and x-ray astrophysics. We have developed room temperature digital feedback electronics and a successful SQUID multiplexing

Energy Dispersive X-ray Analysis using a Microcalorimeter Detector

January 29, 2001
Author(s)
W. Harris, L. Le Tarte, H. Bakhru, W. Gibson, D. Wu, Robert E. Geer, David A. Wollman
Energy dispersive X-ray analysis (EDX) is widely used within the semiconductor community for chemical analysis and identification of features observed in scanning electron microscopy images. While this technique provides valuable information for defect

Low Voltage Microanalysis using Microcalorimeter EDS

January 1, 2001
Author(s)
David A. Wollman, Sae Woo Nam, Gene C. Hilton, Kent D. Irwin, David A. Rudman, Norman F. Bergren, Steven Deiker, John M. Martinis, Martin Huber, Dale Newbury
We present the current performance of the prototype high-resolution microcalorimeter energy-dispersive spectrometer (υcal EDS) developed at NIST for x-ray microanalysis. In particular, the low-energy υcal EDS designed for operation in the energy range from

A Mo-Cu Superconducting Transition-Edge Microcalorimeter with 4.5 eV Energy Resolution at 6 keV

December 31, 2000
Author(s)
Kent D. Irwin, Gene C. Hilton, John M. Martinis, Steven Deiker, Norman F. Bergren, Sae Woo Nam, David A. Rudman, David A. Wollman
We describe a superconducting transition-edge microcalorimeter with an energy resolution of 4.5 1 0.1 eV full-width at half-maximum (FWHM) for Mn Kα X-rays from an 55Fe source. The thermometer consists of a photolithographically patterned Mo-Cu

Superconducting Transition-Edge-Microcalorimeter X-ray Spectrometer with 2 eV Energy Resolution at 1.5 keV

December 31, 2000
Author(s)
David A. Wollman, Sae Woo Nam, Dale Newbury, Gene C. Hilton, Kent D. Irwin, Norman F. Bergren, Steven Deiker, David A. Rudman, John M. Martinis
We describe the operation and performance of a prototype microcalorimeter ?energy-dispersive? (nondispersive) x-ray spectrometer (mcal EDS) developed at NIST for use in x-ray microanalysis and x-ray astronomy. The low-energy microcalorimeter detector

Development of Arrays of TES X-ray Detectors

December 1, 2000
Author(s)
Steven Deiker, James A. Chervenak, Gene C. Hilton, Martin Huber, Kent D. Irwin, John M. Martinis, Sae Woo Nam, David A. Wollman
Both the x-ray astrophysics and microanalysis communities have a need for large format arrays of high-spectral-resolution x-ray detectors. To meet this need, we are transferring our successful single pixel Transition Edge Sensor (TES) x-ray

Microcalorimeter Energy Dispersive X-ray Spectrometer for Low Voltage Microanalysis

November 1, 2000
Author(s)
David A. Wollman, John M. Martinis, Sae Woo Nam, Gene C. Hilton, Kent D. Irwin, David A. Rudman, Norman F. Bergren, Steven Deiker, Martin Huber, Dale Newbury
Improved x-ray detector technology continues to be a critical metrological need in the semiconductor industry for contaminant particle analysis 1,2 and for high-spatial-resolution x-ray microanalysis using low-beam-voltage field-emission scanning electron

Comparison of Elemental Detection Using Microcalorimetry, SIMS, AES and EDS (SEM, STEM, and TEM)

August 1, 2000
Author(s)
C. B. Vartuli, F. A. Stevie, David A. Wollman, M. Antonell, R. B. Irwin, J. M. McKinley, T L. Shofner, B. M. Purcell, S. A. Anderson, Bobby To
Cu contamination has become a larger concern as more semiconductor fabrication facilities switch from aluminum to Cu interconnects. The resolution limits of several analytical tools are compared to determine the optimum analysis methods for detecting Cu