June 1, 2005
Author(s)
Charles J. Burroughs, Samuel Benz, Paul Dresselhaus, Yonuk Chong, Hirotake Yamamori
We have developed a method of bonding superconductive integrated-circuit chips to interchangeable, microwave-compatible, flexible cryo-packages. This new 'flip-chip on flex' technology will greatly improve the service life and reliability of our Josephson