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Security Advantages and Challenges of 3D Heterogenous Integration

Published

Author(s)

Yuntao Liu, Daniel Xing, Isaac McDaniel, Olsan Ozbay, Abir Ahsan Akib, Mumtahina Islam Sukanya, Sanjay (Jay) Rekhi, Ankur Srivastava

Abstract

Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge.
Citation
IEEE Computer Magazine
Volume
57
Issue
3

Keywords

3D Heterogeneous Integration, Hardware Security, Split Manufacturing, Side-Channel Attacks

Citation

Liu, Y. , Xing, D. , McDaniel, I. , Ozbay, O. , Akib, A. , Sukanya, M. , Rekhi, S. and Srivastava, A. (2024), Security Advantages and Challenges of 3D Heterogenous Integration, IEEE Computer Magazine, [online], https://doi.org/10.1109/MC.2023.3340798, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=957100 (Accessed December 4, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created March 6, 2024, Updated August 21, 2024