Liew, L.
, Moreland, J.
and Gerginov, V.
(2006),
Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices, Proceedings of 20th Eurosensors Conference, Goteborg, 1, SW, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=32413
(Accessed December 26, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices
Published
Author(s)
, , V Gerginov
Abstract
We describe the wafer-level fabrication of cesium vapor cells by evaporation and photolysis of cesium azide for chip-scale atomic devices. The advantage is that, unlike existing cell-fabrication methods which require fluid handling devices for filling individual and separately fabricated cells, here the filling step itself is done by thin-film deposition and thus integrated monolithically with the rest of the fabrication process.Proceedings Title
Proceedings of 20th Eurosensors Conference
Conference Dates
September 17-20, 2006
Conference Location
Goteborg, 1, SW
Pub Type
Conferences
Download Paper
Keywords
atomic clock, cell, cesium
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created October 15, 2006, Updated October 15, 2021