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On May 5, 2024,theU.S. Department of Commerce issued a NOFO to seek proposals from eligible applicants for activities to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry.
The CHIPS for America Program anticipates up to approximately $285 million for a first-of-its kind institute focused on the development, validation, and use of digital twins for semiconductor manufacturing, advanced packaging, assembly, and test processes.
Concept papers are due June 20, 2024, and must be received at Grants.gov no later than 11:59 p.m. Eastern Time. Applications received after this deadline will not be reviewed or considered.
Click here for more information about the NOFO and application process.
On April 16, 2024, the U.S. Department of Commerce issued a NOFO to seek applications from eligible small businesses to explore the technical merit or feasibility of an innovative idea or technology for developing a viable product or service for introduction in the commercial microelectronics marketplace.
The CHIPS for America program anticipates up to approximately $54 million in funding across multiple topics on research projects for critically needed measurement services, tools, and instrumentation; innovative manufacturing metrologies; novel assurance and provenance technologies and advanced metrology research and development (R&D) testbeds to help secure U.S. leadership in the global semiconductor industry.
Concept papers are due June 14, 2024 and must be received at Grants.gov no later than 11:59 p.m. Eastern Time. Applications received after this deadline will not be reviewed or considered.
Click here for more information about the NOFO and application process.
The purpose of the CHIPS Research and Development (R&D) programs is to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. The CHIPS R&D programs have three goals:
Establish the capacity to invent, develop, prototype, and deploy the foundational semiconductor technologies of the future – here in America.
Accelerate ideas to market. We want the best ideas to achieve commercial scale as quickly and cost effectively as possible, and
Contribute to a robust semiconductor workforce. We want enough inventors, designers, researchers, developers, engineers, technicians, and staff to meet the needs of government and commercial sectors.
The CHIPS R&D programs address five cross-cutting issues that we identified through interactions with stakeholders:
Access to facilities and equipment for late-stage R&D and prototyping
To address these semiconductor R&D ecosystem gaps, CHIPS for America invests $11 billion in four integrated entities, all of which include some aspect of workforce training. These programs will share infrastructure, participants, and projects. They will operate in coordination with each other, with the CHIPS Incentives Program, and with microelectronics R&D programs supported by other U.S. federal agencies. CHIPS R&D programs will be informed by industry’s needs, and innovations from the R&D programs will accelerate innovation and increase competitiveness in the American semiconductor industry and establish our leadership in the sector for decades to come.
CHIPS National Advanced Packaging Manufacturing Program– The U.S. needs to develop the capability to package chips together in multiple dimensions with a variety of functions—known as advanced packaging—to regain and maintain leadership in semiconductor manufacturing. The NAPMP and NSTC will work closely together. Learn more about the NAPMP vision.
CHIPS Manufacturing USA Institute – CHIPS for America will fund a new Manufacturing USA institute dedicated to digital twin technology for semiconductor manufacturing technologies, and related workforce training.
CHIPS Metrology – NIST will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods for semiconductors. NIST will also work on reference materials, reference data, and calibrations for the precision equipment used in chip manufacturing, and advise on the development of standards for processes and cybersecurity.
Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and
Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme