TY  - GEN
AU  - Rule, D L
AU  - Smith, D R
AU  - Sparks, L L
C2  - , National Institute of Standards and Technology, Gaithersburg, MD
DA  - 1990-01-01 05:01:00
DO  - https://doi.org/10.6028/NIST.IR.3948
LA  - en
PB  - , National Institute of Standards and Technology, Gaithersburg, MD
PY  - 1990
TI  - Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler:
ER  -