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Projects/Programs

Displaying 26 - 50 of 95

EUV Scatterometry

Ongoing
To measure and inspect the smallest printed features on an IC chip, researchers and manufacturers use a combination of electron scanning modalities (i.e., transmission electron and scanning electron microscopies) and an optical method, scatterometry. Industrially, the most common modality for

Evaluation of 2D and WBG Material Quality Toward Device Reliability

Ongoing
Two-dimensional (2D) and wide band gap (WBG) materials are some of the latest materials classes having the potential to be transformative because of their high carrier mobilities, tunable bandgap, and atomic-scale film thicknesses. Unexpected degradation and failure in device performance is often

Flexible and Printed Electronics

Ongoing
Approach Developing commercial products based on organic electronics requires materials that deliver predictable and reproducible performance. One advantage of these materials is their compatibility with versatile solution processing methods. However, this advantage can lead to unpredictable

Fluid Suspensions and Emulsions

Ongoing
We aim to: Develop measurement capabilities to relate solution structure and viscosity through novel combinations of unique small volume, high shear rate rheometers with scattering and particle-imaging techniques. A major application of these capabilities is understanding self-association in fluids

Fundamentals of Deformation

Ongoing
• We have provided general users from industry, academia and national laboratories with a completely new class of X-ray imaging techniques for materials studies (ultra-small-angle X-ray scattering imaging), that we developed from basic concept to DOE-supported operations at the Advanced Photon

Future Directions for Magnetic Sensors

Completed
Bringing new or improved magnetic sensors to market requires modeling for rapid assessment of the effect of new designs or improved materials properties. To this end, we are investigating the fundamental properties of a new class of magnetic sensors that is rapidly displacing ones based on older

Hardness Standardization and Measurements

Ongoing
DESCRIPTION Purpose: Provide measurement traceability for the Knoop, Rockwell, and Vickers hardness scales and for coating thickness measurements that are based on magnetic methods. Goals: Harmonization of hardness and coating thickness testing protocols, in pursuit of reduction of measurement

High Performance Crystal Plasticity

Ongoing
“Crystal plasticity” is a computationally intensive way of computing the behavior of materials undergoing large permanent deformations. Computation is very inhomogeneous: A large effort is expended everywhere, but only a small portion of the computational domain is doing anything interesting. We

High Rate Testing

Ongoing
This project involves sample geometry and metrological development for high rate servohydraulic testing. (Content to be uploaded soon)

High Speed Metrology for Magnetoelectronic Devices and Models

Ongoing
The U.S. Semiconductor industry is integrating ferromagnet-based microelectronic devices such as magnetic RAM (MRAM) into existing silicon-based technologies. MRAM has much shorter write times and higher write endurance than the embedded Flash currently used. These properties makes MRAM highly

JARVIS-ALIGNN, JARVIS-ALIGNN-FF

Ongoing
ALIGNN uses a line graph neural networks to include bond distances and angular information graph to incorporate finer details of atomic structure, leading to high accuracy models. While the nodes of an atomistic graph correspond to atoms and its edges correspond to bonds, the nodes of an atomistic

JARVIS-DFT

Ongoing
JARVIS-DFT hosts materials property data for ~40000 bulk and ~1000 low-dimensional crystalline materials and the database is continuously expanding. Some of the properties in the database are: formation energies, bandgaps, elastic, piezoelectric, dielectric constants, and magnetic moments

JARVIS-ML

Ongoing
JARVIS-ML introduced Classical Force-field Inspired Descriptors (CFID) as a universal framework to represent a material’s chemistry-structure-charge related data. With the help of CFID and JARVIS-DFT data, several high-accuracy classifications and regression ML models were developed, with

Lead-Free Solder

Completed
The U.S. microelectronics industry has clearly articulated the measurement needs for lead-free solders, and for solderability and assembly. For example, the urgency for materials data for lead-free solders has been specified in the 1997 IPC, 1999 International Technology Roadmap for Semiconductors

Lead-Free Surface Finishes for Electronic Components: Tin Whisker Growth

Completed
Tin is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity, and corrosion resistance. Unfortunately, tin whiskers often grow spontaneously from pure tin electrodeposits and short-circuit finely pitched electrical

Macromolecular Architectures

Ongoing
This project’s purpose is to synthesize and characterize model thermoplastics, thermoplastic elastomers (TPE), and mixed resins with systematic variation of polymer sequence, chemistry, and architectures to generate libraries of quantitative structure-property relationships validated by multiple

Macromolecule and Nanoparticle Composition and Architecture

Completed
Bringing new products to market requires measurements for rapid, quantitative assessment of composition and structure. To this end, NIST has developed a series of mass spectrometry-based tools that decrease the time necessary to achieve measurement success while producing more accurate results. The

Magnetic Imaging

Completed
Advanced magnetic devices and storage media will rely on ultra thin ferromagnetic films; since such films are quasi two-dimensional magnets, they can have strong perpendicular magnetic anisotropy (PMA). Optimization of future materials, including improved yields, requires an ability to measure film

Magnetic Materials Metrology

Ongoing
Our aim is to develop the metrology for control and manipulation of magnetic anisotropy in magnetic materials. This includes development of the measurement science for quantification of the magnetic properties (e.g., magnetic anisotropy, magnetic exchange) and the structure-property-processing

Magnetic Nanostructures for post-CMOS Electronics

Completed
We focus primarily on arrays of magnetic nanostructures in order to reveal how defects alter the fundamental physics of magnetization reversal processes in the nanometer regime. We have an integrated approach that consists of four inter-related elements. The first element, film edge metrology

Marciniak Multiaxial Testing

Ongoing
This X-ray system can measure the full 3D stress tensor of the sheet in situ under multiaxial tension. The test is performed by raising the punch to stretch the sheet incrementally, then a hold is placed while the stress measurement is made. This step takes 2-4 minutes depending on the accuracy

Materials Informatics

Ongoing
To develop the need data infrastructure and informatics tools, NIST is focusing on three areas: data curation, data infrastructure, and data access. Data curation efforts include efforts to develop a phase-based materials ontology to ensure that the data is represented in a semantically

Measurements for Hydrogen Storage Materials

Completed
The evaluation of candidate storage materials is complicated by a lack of readily available methods for the direct measurement of hydrogen content. MML is working together with researchers from NCNR, and PML to provide measurement tools to fill this gap. Prompt Gamma Activation Analysis (PGAA) is a