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Electronics

Semiconductors

Projects/Programs

Keyword

Organizational Unit

Metrology for extreme ultraviolet lithography

Ongoing

Patterning with light 13 nm brings a host a new challenges Light at 13 nm is well within the vacuum ultraviolet, where radiation is strongly absorbed by all materials. This requires that the technology take place in vacuum and rely on mirrors rather than lenses. Moreover generating sufficient

RF Metrology for High-Frequency Transistor Models

Ongoing

Due to the challenges of high-frequency measurements, that includes inaccuracy in on-wafer calibration and a lack of instrumentation for transistor characterization, models are currently extracted from low frequency measurements and extrapolated to higher frequencies. This methodology has been shown

Metrology for Integration of New Magnetic Materials

Ongoing

Integration of magnetic materials remains a key challenge facing advanced packaging technologies. High power applications require voltage conversion at or near the die, and most practical power converters rely on inductors. Beyond power electronics, integration of magnetic components such as

Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging

Ongoing

The most important part of any bonding process is getting the surfaces to stick. While the physical properties of the films, surfaces, and interfaces in conjunction with the bonding process parameters (pressure, duration, temperature, and post bond anneal) all play important roles, altering the

Metrology of Purity and Contaminants in Solid Materials

Ongoing

Purity evaluations of high-purity bulk materials used in chips manufacturing are calibrated against reference materials that are often not matrix-matched to the materials under test. In other words, differences in the compositions of the calibrants and the samples being analyzed can result in large

A micromechanical bulk acoustic resonator that uses phononic crystal tethers to achieve a quality factor approaching the fundamental dissipation limit (fxQ can be as large as 1.2 x 1013 Hz)

Micro- and Nanoelectromechanical Systems

Completed

MEMS/NEMS are enabling technologies that bring new functionalities with the potential to radically transform markets ranging from consumer products to national defense. The meteoric rise of the smartphone is an excellent example, in which MEMS accelerometers, gyroscopes, microphones, displays, and

Molecular Dynamics Simulation of Heat Transport in Gate-All-Around Transistors

Ongoing

Thermal efficiency of semiconductor devices is pivotal to their operation and performance, especially now that the dimensions of transistor features are rapidly shrinking to the nanoscale. A significant knowledge gap persists in accurately describing and quantifying heat dissipation at such scales

Multiscale Modeling and Validation of Semiconductor Materials and Devices

Ongoing

The limitations of scaling traditional CMOS (complementary metal-oxide semiconductors) designs have necessitated that the semiconductor industry consider new materials and design concepts. For wide bandgap semiconductor devices, optimization of materials and fabrication processes is needed to

Nanocalorimetry

Ongoing

The global market for semiconductor chips is $270 billion. Growth in this industry is driven by the need to enhance performance by packing more transistors into the same chip area, with a relationship between feature size and time that approximately follows Moore's Law. As the feature size shrinks

Nanocalorimetry Measurements

Ongoing

Accurate thermodynamic measurements are essential to understand fundamental properties of materials, providing direct and quantifiable insight into the thermodynamics of thin film reactions and phase transitions. Going forward, new classes of materials may only be synthesized as thin films, a scale

Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Ongoing

In September 2022, NIST published a report titled Strategic Opportunities for U.S. Semiconductor Manufacturing , which cited, among other challenges, the need to understand and improve heat dissipation and performance in advanced microelectronics. Specifically, there needs to be better measurements

Nanoelectromagnetics

Ongoing

The primary goal of this program is metrology that enables advanced nanoscale device (including electronics, spintronics, and life science) development. Based on current trends in electronics, we are focusing on metrology for two classes of devices: (1) nanoscale devices utilizing and exploring new

Nanometrology: Composition and Structure of Nanomaterials

Ongoing

Pushing the Limits of Measurement Accuracy in Atom Probe Mass Spectrometry Nanoscale Analysis of Biological and Organic Materials Release from Nanocomposite Consumer Products

Nanophononic Metamaterials for Thermoelectrics

Ongoing

About 68 % of the energy produced in the United States is wasted as heat lost to the environment. About a quarter of this lost heat is present at temperature gradients suitable for recovery with thermoelectric devices, which use the ability of semiconductors to generate electricity directly from

Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology

Ongoing

Industry roadmaps identify the characterization of nanoscale subsurface feature shape and composition as a measurement need for the semiconductor industry. However, IC interiors are difficult to probe post-manufacturing due to the presence of many close-packed and nanoscale subsurface features, of

Nanoscale Property Measurements by Atomic Force Microscopy

Ongoing

Over the past several decades, Atomic Force Microscopy (AFM) has advanced from a technique used primarily for surface topography imaging to one capable of characterizing a range of chemical, mechanical, electrical, and magnetic material properties with nanometer resolution. Such characterizations

A scanning electron micrograph of a QDOGFET device used for photon number-resolving detection.

Nanostructure Fabrication and Metrology

Completed

This project develops semiconductor nanostructures, especially self-assembled quantum dots and photonic crystals, for a variety of applications including single photonics, laser diodes, and quantum optical metrology. It also develops quantum optical metrology based on other sources and detectors

The Nanotechnology Xccelerator

Ongoing

The Nanotechnology Xccelerator was announced on September 13, 2022 and was officially accepted for production at Skywater Technology Foundry using the Sky130 technology in Q1 2024. Sky130, which comes in both a conventional and open-source process design kit, is a 5-metal layer process. To

Neuromorphic Device Measurements

Ongoing

One type of device that is emerging as an attractive artificial synapse is the resistive switch, or memristor. These devices, which usually consist of a thin layer of oxide between two electrodes, have conductivity that depends on their history of applied voltage, and thus have highly nonlinear

Non-Destructive Semiconductor Structure Function and Process Optimization for future Microelectronics Manufacturing at the NIST NSLS-II Beamline for XAFS and Diffraction

Ongoing

This project relies on the existing NIST Synchrotron beamline for X-ray diffraction (XRD), and X-ray absorption spectroscopy (XAS) to improve measurement capabilities. The proposed equipment enhancements will substantially increase sample throughput and sensitivity. Driving the ability to probe

Novel Sources for Focused-ion Beams

Completed

Commercial focused ion beams (FIBs) are used in a wide variety of applications. For example, they serve as diagnostic tools, slicing through a nanodevice to expose its internal structure. They can also shape nanoscale materials either by adding atoms to a structure or by shaving them off. And they

Optical and Microwave Spectroscopy of Microelectronic Systems

Ongoing

Collaborations with industry leaders have led to new understanding of magnetic damping in advanced materials and replication of our magnetic metrology tools. We investigate fundamental aspects of spin transfer in materials and structures that offer improved performance in future devices such as

Optical Probes of 2D Magnetic Phenomena

Ongoing

The unique measurement capabilities developed in this Project enable diffraction-limited, optical spectra (both Raman and photoluminescence) to be collected and analyzed as a function of laser energy, polarization, temperature, magnetic field, and device parameters such as current load and back

Overcoming Barriers: Nanoscale Interface Metrology and Electrical Characterization for Advanced Electronics

Ongoing

“The interface is the device,” Herbert Kroemer, 2000 Nobel Laureate. This is even more true today, twenty-three years later, when device dimensions are measured in numbers of atoms rather than numbers of micrometers. Historically, interface problems in the semiconductor industry have been addressed

Plasma Process Metrology

Ongoing

Intended Impact The model for rf bias effects that we have developed should make it easier for industry to select optimal operating frequencies and may stimulate the adoption of new methods for RF biasing, such as multiple-frequency bias and non-sinusoidal bias. NIST studies of electrical endpoint

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
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----Opportunity & Inclusion Group
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----Integration & Policy Office
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---External R&D Partnerships Division
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----National Advanced Packaging Manufacturing Program Group
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--Communications Technology Laboratory
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----IoT Devices and Infrastructures Group
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---Spectrum Technology and Research Division
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----Spectrum Technology and Research – HQ
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---Building Energy and Environment Division
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---Materials and Structural Systems Division
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----Polymeric Materials Group
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---Special Programs Office
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---Office of Reference Materials
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----Office of Reference Materials - HQ
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---Office of Data and Informatics
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----Data Services Group
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---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
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----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
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-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
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---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
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----Program Operations - HQ
---Strategy and Planning Division
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----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
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----Outreach and Communications Group
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----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
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---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
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---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
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----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
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--Director's Office
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