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NanoFab Tool: Harrick Plasma PDC-32 Plasma Bonder
The Harrick Plasma PDC-32 plasma bonder is used to remove fine particles on user substrates prior to release agent treatment and to modify the surface bonds of a polydimethylsiloxane (PDMS) mold to promote permanent bonding of the mold to a substrate.The plasma bonder supports substrates ranging from 75 mm wafers down to small pieces.
Specifications/Capabilities
- Maximum RFpower: 18 W.
- Adjustable RFpower: Three settings for low, medium, and high power.
- Metered gasflow.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 75 mm (3 in).
- Small pieces supported: Yes.
Typical Applications
- Pre-silanization clean.
- PDMS surface activation for bonding.
- Microfluidic device fabrication.
Created February 11, 2015, Updated February 24, 2023