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NanoFab Equipment
Over 100 commercial tools are available within the NanoFab's 5600 m2 (60,000 ft2) of advanced laboratory space, which includes 1800 m2 (19,000 ft2) of cleanroom. Most tools are located in the 750 m2 (8,000 ft2) class 100 cleanroom. Our key capabilities, tools, and processes are summarized below.
Lithography
- Spin Coater: CEE Apogee Spinner
- Direct Write Electron Beam Lithography System: JEOL JBX 6300-FS
- Direct Write Electron Beam Lithography System: JEOL JBX 6300-FS (Cleanroom)
- Maskless Aligner: Heidelberg MLA 150
- Stepper: ASML PAS5500/275D
- Laser Pattern Generator: Heidelberg Instruments DWL 2000
- Contact Aligner: ABM Mask Contact Aligner
- Contact Aligner: Suss MicroTec MA6/BA6 Gen 4
- Automated Resist Coater: Suss MicroTec ACS200
- Automated Resist Developer: Suss MicroTec Delta12AQ
- Nano-Imprint Lithography (NIL) System: Nanonex NX-2000
- Photoresist Stabilization System: Bachur & Associates LS-200FSX
Soft Lithography
- Silanization Oven: Yield Engineering System YES-1224P
- Microfluidic Test Station: CorSolutions FLD20-T
- PDMS Casting Station
- Assembly Hood: Envirco Laminar Hood
- Plasma Bonder: Harrick Plasma PDC-32
- Forced Convection Curing Oven: Jeio Tech OF-12G
Focused Ion Beam Nanofabrication and Characterization
- Dual Beam Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) 1: FEI Helios NanoLab 660
- Dual Beam Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) 2: FEI Helios NanoLab 660
Advanced Imaging and Analysis
- Analytical Transmission Electron Microscope: FEI Titan 80-300
- Field Emission Scanning Electron Microscope: Zeiss Gemini 500
- Field Emission Scanning Electron Microscope: Zeiss Gemini 560
- Atomic Force Microscope: Bruker Dimension FastScan
- Atomic Force Microscope: Asylum Jupiter XR
- X-Ray Diffraction: Rigaku SmartLab
Imaging and Analysis Sample and Substrate Preparation
- Glow Discharge Cleaning: Pelco easiGlow Glow Discharge System
- Automatic Plunge Freezer: Leica EM GP
- NanoMill Ion Mill: Fischone Model 1040
- Cleaving Tool: Lattice Gear LatticAx
Metrology
- Compound Optical Microscope: Nikon L200
- Stereo Microscope: Nikon SMZ1500
- Stereo Microscope: Olympus SZH10
- Contact Angle Goniometer: First Ten Angstroms FTA125
- Contact Profilometer: Bruker Dektak XT
- Contact Profilometer: Bruker Dektak 6M
- Optical Profilometer: Sensofar
- Hall Effect Measurement: Ecopia HMS-5500
- Reflectometer: Filmetrics F40-UV Thin Film Measurement
- Reflectometer: Filmetrics F50-UV Thin Film Mapping system
- Four Point Probe: Four Dimension 280DI
- Mercury Probe: Four Dimensions CV92A
- Parametric Test Station: Keithley 4200 SCS
- Spectroscopic Ellipsometer: J.A. Woollam M-2000 DI
- Stress Measurement Tool: Toho Technology FLX-2320
Thin Film Deposition and Processing
- Rapid Thermal Annealer: AnnealSys AS-Master
- Evaporator: Denton Vacuum Infinity 22
- Electron Beam and Thermal Evaporator: Denton Vacuum Infinity 22
- Thermal Thin-Al Evaporator: Denton Bench Top Turbo
- Cluster Sputter Deposition System: 4Wave IBD/BTD
- Sputtering System B104 Left: Denton Vacuum Discovery 550
- Sputtering System B104 Right: Denton Vacuum Discovery 550
- Atomic Layer Deposition: Arradiance Gemstar
- Atomic Layer Deposition: Oxford FlexAL
- High Density Plasma Enhanced Chemical Vapor Deposition: Plasma-Therm Versaline
- Plasma Enhanced Chemical Vapor Deposition: Oxford Plasmalab 100
- Parylene Deposition System: Specialty Coating Systems PDS 2010
- Wafer Bonder: Suss MicroTec SB6 Gen 2
- LPCVD Silicon Nitride: Sandvik
- LPCVD Polysilicon: Sandvik
- Thermal Oxidation Furnaces: Sandvik
- Anneal Furnaces: Sandvik
- LPCVD LTO: Sandvik
Dry Etch
- Deep Silicon Etcher: SPTS Omega c2L Rapier
- Deep Silicon Etcher: Unaxis Shuttleline DSEII
- Downstream Plasma Asher: AllWin21 AW-1008
- Microwave Asher: PVA Tepla 300
- Inductively Coupled Plasma (ICP) Dielectric Etcher: Oxford PlasmaPro 100
- Inductively Coupled Plasma (ICP) Etcher: Unaxis Shuttleline
- Inductively Coupled Plasma (ICP) Metal Etcher: Oxford Plasmalab 100
- Inductively Coupled Plasma (ICP) Silicon Etcher: Oxford Plasmalab 100
- Inductively Coupled Plasma (ICP) III-V Etcher: Oxford PlasmaPro 100
- Ion Milling System: 4Wave IBE-20B
- Reactive Ion Etcher: Unaxis 790 Middle
- Reactive Ion Etcher: Unaxis 790 Right
- Reactive Ion Etcher: Unaxis 790 Nitride Left
- Hydrofluoric Acid Vapor Etcher: SPTS microEtch
- Xenon Difluoride Silicon Etcher: Xactix Xetch
Back-End-of-Line Tools
- Dicing Saw: ADT 7132
- Flip Chip Bonder: Tresky T-3000-FC3-HF
- Wedge Wire Bonder: Kulicke and Soffa Model 4526
- Chemical Mechanical Polisher (CMP): IPEC 472
- Post-CMP Wafer Cleaner: GnP 412S
Wet Chemistry
- Single Wafer Cleaning System 1: SSEC Model 3300ML
- Single Wafer Cleaning System 2: SSEC Model 3300ML
- Single Wafer Cleaning System 3: SSEC Model 3300ML
- Critical Point Dryer: Tousimis Automegasamdri-916B Series C
- Critical Point Dryer: Tousimis Automegasamdri-815 Series B
- Spray Solvent Lift-off Tool: Microprocess Technology Avenger
- RCA Wet Bench: Reynolds
- RCA Wet Bench B102: Reynolds
- Silicon Nitride Etch Wet Bench: Reynolds
- Silicon Etch Wet Bench: Reynolds
- Spin Rinse Dryer: Semitool PSC-101
Created September 13, 2013, Updated May 15, 2024