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Probe corrected 200kV analytic electron microscope Resolves single atoms Chemical analytic capability (EELS, EDS) Highest resolution in electron optics (<0.1 nm
The 4Wave IBD/BTD cluster sputter deposition system can automatically load and unload two six target chambers to provide users a largely unattended 24/7
The Allied High Tech Dual Prep PH-3 grinding and polishing system is used to mechanically thin samples and polish cleaved facets in preparation for high
The Bachur & Associates LS-200FSX Photoresist Stabilization System provides deep-ultraviolet (DUV) flood exposure and resist curing. The system strengthens
The Bruker Dektak 6M contact profilometer measures the thickness of patterned thin films by sensing the deflections of a fine stylus riding over feature steps
The Bruker Dimension FastScan atomic force microscope (AFM) combines a high-speed scanning AFM, programmable stage control, and a user friendly interface to
The Denton Vacuum Discovery 550 sputtering system has two direct current (DC) and two radio frequency (RF) sputtering guns which bombard targets, causing atoms
The Denton Vacuum Discovery 550 sputtering system has two direct current (DC) and two radio frequency (RF) sputtering guns which bombard targets, causing atoms
The Denton Vacuum Infinity 22 dual source evaporator uses a choice of either electron beam evaporation or resistive heating to vapor deposit thin films
The Denton Vacuum Infinity 22 electron beam evaporator vapor deposits thin films and is capable of loading up to six source materials for deposition. The
The HMS-5500 Hall Effect measurement system is used to measure electrical resistivity, carrier density, and mobility of semiconducting materials. The system is
The FEI Helios 660 dual-beam microscope combines a monochromated field emission scanning electron microscope (FE-SEM) with an advanced focused ion beam (FIB)
The FEI Titan 80-300 scanning transmission electron microscope (STEM) is an advanced analytical field emission scanning transmission electron microscope capable
The Filmetrics F50 is an automated thin-film thickness mapping system equipped with a motorized r-theta stage that moves automatically to selected measurement
The First Ten Angstroms FTA125 is a general purpose goniometer that can measure the contact angle and surface tension of liquid droplets on a substrate's
The Fischione Model 1040 NanoMill is a low-energy, low-angle argon ion milling instrument used for preparing ultra-thin, high-quality transmission electron
The Four Dimensions 280DI sheet resistance mapping system uses the 4-point probe technique to measure the sheet resistance of substrates and films. The
The Heidelberg Instruments DWL 2000 Laser Pattern Generator uses a high resolution laser to expose photoresist for substrate patterning of features as small as
The CMP removes material both chemically, by use of a corrosive colloidal slurry, and mechanically, by way of a wafer carrier under controlled pressure rotating
The J. A. Woollam M-2000 DI spectroscopic ellipsometer provides fast and accurate thin film characterization over a wide spectroscopic range. The high speed CCD
The Jeio Tech OF-12G forced convection oven is used in the soft lithography processing to perform a dehydration bake prior to silanization and cure samples
The JEOL JBX 6300-FS direct write electron beam lithography system allows users to quickly and directly pattern a variety of substrate materials with features
The Keithley 4200 SCS parametric test system provides in-line electrical characterization capabilities, including the ability to measure capacitance at multiple
The Kulicke and Soffa Model 4526 wedge wire bonder provides electrical interconnects between a device chip and package using thin aluminum or gold wires. The
The Microprocess Technology Avenger spray solvent lift-off tool uses a heated spray solvent to remove residual material and photoresist after deposition of a