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METIS

Products

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METIS is the home for data products produced by the CHIPS Metrology Program. The following are common data product types you will find:

  • Data, or datasets are the typical digitized outputs of either an experimental or computation procedure.
  • Code is an arbitrary unit of instruction written in a computer language that executes a particular task(s). Examples are segmentation codes and data reduction algorithms.
  • Model is a collection of codes that mimics a physical entity or process.
  • Software is a collection of codes that can include one or more models, packaged in such a way that can be executed by people with varying levels of expertise.
  • Guide is a documentary output. Examples are white papers and best-practice guides.
  • Database is a collection of related data.
  • Repository (or repo) is a collection of databases.
  • Service, specifically in this case, refers to a web-based interaction platform where a prospective recipient can request an action (for example: calibration, evaluation), and the requested service is rendered by a service provided through a web portal.

A special class of CHIPS Metrology outputs (denoted by *) are governed by strict definitions (for data and for materials and instruments) and are quality assessed. Some products are non-digital (e.g., a Reference Material, a new instrument), and they are listed for informational purposes.

In addition to the direct outputs from the Seven Grand Challenges outlined in Strategic Opportunities for U.S. Semiconductor Manufacturing, the CHIPS Metrology METIS Collection also includes datasets that predate Strategic Opportunities for U.S. Semiconductor Manufacturing (summary table below), the CHIPS Metrology METIS Collection also includes datasets that predates the 2022 CHIPS Act but are nonetheless relevant to the semiconductor industry. Contributed data products from NIST partners and collaborators will appear here as they become available.

CHIPS Metrology Program Areas:

Product NameTypeAccess
Hazardous gas flow dataSRD*Contact METIS
High-purity solid materials (Si, Ge, Cu, Au, Ag, GeSi, AlGaN)RGTM*, RM*, SRM*Contact METIS
 

Product NameTypeAccess
Electron yield ModelModelComing to METIS
simulation software for electric fieldSoftwareComing to METIS
Atom Probe White Paper and Best PracticeGuideComing to METIS
electrostatic data and modeling parameters for ATPDataComing to METIS
pySCATMECH - Python wrapper for SCATMECHCode

https://github.com/usnistgov/pySCATMECH

 

SCATMECH - Model for light scatteringModelhttps://pages.nist.gov/SCATMECH/docs/index.htm
Scatterometry fit libraryCodeComing to METIS
Data reduction algorithm for energy absorption spectroscopy (XAFS) and diffractionCodeComing to METIS
Open-source software package for strain mapping via precession 4D-STEM SoftwareComing to METIS
Small-angle x-ray scattering (CDSAXS) test structuresRGTM*Contact METIS

Product NameTypeAccess
Calnet calibration serviceServicehttps://calnet.nist.gov/
S-parameter calibration databaseDatabaseComing to METIS
S-parameter calibration kit designDesignComing to METIS
S-parameter calibration procedureGuideComing to METIS
S-parameter calibration measurement protocolGuideComing to METIS
S-parameter modelsModelComing to METIS
S-parameter calibration kit measurement dataDatahttps://data.nist.gov/od/id/mds2-3404
Permittivity Standard Reference MaterialSRM*Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
On-wafer S-parameter calibration instrumentSRI*Contact METIS
Best-practice guide for nano-to-microscale thermomechanical characterization of advanced packaging materialsGuideComing to METIS
Thermomechanical data manufacturing process modelingDataComing to METIS
System performance metrics for x-ray computed tomography instrumentation ModelComing to METIS
Kinetics analysis tool kit for modeling reactions of advanced packaging polymersCodeComing to METIS
Database of advanced packaging polymers property changes in response to environmental stressesDatabaseComing to METIS

Product NameTypeAccess
Computation and some experimental datasets of electrical transport properties, electrostatic potential, Schottky barrier height, interface resistance, interatomic potential, electronic band structure, crystal structure, lattice mismatch (and inferences on lattice stress-strain), device energy consumption, phonon transport, thermal properties (and inferences on reliability and failure modes) for a variety of materials found in semiconductor devices.Repohttps://jarvis.nist.gov/, https://www.ctcms.nist.gov/potentials
Code to produce computational data for electrical transport properties, electrostatic potential, Schottky barrier height, interface resistance, interatomic potential, electronic band structure, crystal structure, lattice mismatch, device energy consumption, phonon transport, thermal properties for a variety of materials found in semiconductor devices.CodeAccess through https://jarvis.nist.gov/
Model for electrical transport properties, electrostatic potential, Schottky barrier height, interface resistance, interatomic potential, electronic band structure, crystal structure, lattice mismatch, device energy consumption, phonon transport, thermal properties for a variety of materials found in semiconductor devices.ModelAccess through https://jarvis.nist.gov/
Thermal property measurements for films, surfaces, buried features, and interfaces of key microelectronics materialsDataComing to METIS
Protocol and best-practices for thermoreflectance measurementsGuideComing to METIS
Transistor circuit modelsModelComing to METIS
Statistical models for chip-level process variationsModelComing to METIS
NextG Channel Model AllianceRepohttps://nextg.nist.gov/
AI/ML algorithm to perform live data reduction for channel sounding measurementsRepoAccess through https://nextg.nist.gov/
Libraries of wireless propagation models RepoAccess through https://nextg.nist.gov/
RF propagation models RepoAccess through https://nextg.nist.gov/
Multi-path component extraction algorithmsRepoAccess through https://nextg.nist.gov/
Data challenge for wireless propagation problemsRepoAccess through https://nextg.nist.gov/
Open-source causal Green's function (CGF) tool for modeling thermal transport in nanoscale device componentsCodeComing to METIS
1-million atom input dataset for the CGF toolDataComing to METIS
Multiscale simulation industrial workshops materialGuideComing to METIS
Finite element model of piezoelectric materials for wireless communicationsModelComing to METIS
Datasets of electromechanical properties of piezoelectric materials up to 30 GHzDataComing to METIS
Uncertainty model for electromechanical properties encompassing measurements and material variationsModelComing to METIS
Thermal conductivity test suiteRGTM*Contact METIS
Ferromagnetic Resonance (FMR) data on CoFeBDatahttps://data.nist.gov/od/id/mds2-3408

Product NameTypeAccess
SEM overlay wafersSRM*Contact METIS

Product NameTypeAccess
Reference materials for nanoscale dimensional and materials characterizationRM*Contact METIS

Coming Soon

This is the METIS Beta release; changes to pages and content are expected.
Created September 10, 2024, Updated September 26, 2024