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Electronics

News and Updates

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Organization

Cold Atoms Could Replace Hot Gallium in Focused Ion Beams

November 12, 2008

Scientists at the National Institute of Standards and Technology (NIST) have developed a radical new method of focusing a stream of ions into a point as small

Improved Measurements Could Mean Safer, More Reliable Electroshock Weapons

November 12, 2008

Electroshock weapons – such as stun guns and other similar devices that temporarily incapacitate a person by delivering a high-voltage, low-current electric

Moths with a Nose for Learning

October 1, 2008

Much like Pavlov conditioned his dog to salivate in anticipation of food when a bell rang, insects can be trained to perform certain behaviors when enticed with

Illustration of restacking organic semiconductors

Bottoms Up: Better Organic Semiconductors for Printable Electronics

September 3, 2008

Researchers from the National Institute of Standards and Technology (NIST) and Seoul National University (SNU) have learned how to tweak a new class of polymer

'Electron Trapping' May Impact Future Microelectronics Measurements

June 24, 2008

Using an ultra-fast method of measuring how a transistor switches from the "off" to the "on" state, researchers at the National Institute of Standards and

Exposing the Sensitivity of Extreme Ultraviolet Photoresists

June 24, 2008

Researchers at the National Institute of Standards and Technology (NIST) have confirmed that the photoresists used in next-generation semiconductor

EEEL Researchers Develop Novel Attenuator for High-energy Lasers

June 2, 2008

A laser attenuator having a well-known and stable attenuation can extend the usefulness of an optical power meter for laser radiometry. The challenge of

Artist rendition of a tiny robot approaching a malfunctioning red blood cell

Learn About 'NIST and Nanosoccer' from New Web Site and Video

May 28, 2008

If you love soccer but don't want to wait until the next World Cup in 2010 to satisfy your appetite for the most popular game on Earth, the National Institute

NIST Staff Honored for Technology Transfer

May 28, 2008

John Lehman, Chris Cromer and Xiaoyu Li of the National Institute of Standards and Technology (NIST) have received a 2008 Award for Excellence in Technology

Electron micrograph shows a cross-section of a typical SOG microcircuit feature.

Making a Good Impression: Nanoimprint Lithography Tests at NIST

April 29, 2008

In what should be good news for integrated circuit manufacturers, recent studies by the National Institute of Standards and Technology (NIST) have helped

Colorized micrograph of a NIST chip combining four micro-refrigerators with a superconducting sensor

NIST Micro Sensor and Micro Fridge Make Cool Pair

April 15, 2008

Researchers at the National Institute of Standards and Technology (NIST) have combined two tiny but powerful NIST inventions on a single microchip, a cryogenic

The NIST terahertz imaging system reveals slight temperature differences, as shown in this post-processed image.

Prototype Terahertz Imager Promises Biochem Advances

April 15, 2008

Researchers at the National Institute of Standards and Technology (NIST) have demonstrated a new imaging system that detects naturally occurring terahertz

NIST Team Proves Bridge from Conventional to Molecular Electronics Possible

March 18, 2008

Researchers at the National Institute of Standards and Technology (NIST) have set the stage for building the "evolutionary link" between the microelectronics of

NIST Finds 'Metafilms' Can Shrink Radio, Radar Devices

March 18, 2008

Recent research at the National Institute of Standards and Technology (NIST) has demonstrated that thin films made of "metamaterials"—manmade composites

Good Vibrations Probe Innards of Molecular Electronic Junctions

March 5, 2008

Using an unusual spectroscopic technique, researchers at the National Institute of Standards and Technology (NIST) have provided the most convincing evidence

Directed Self-Ordering of Organic Molecules for Electronic Devices

February 19, 2008

A simple surface treatment technique demonstrated by a collaboration between researchers at the National Institute of Standards and Technology (NIST), Penn

Man wearing a white protective coverall, hood, gloves and face mask, holds a round, purple, sample of a silicon wafer and presses buttons on a white instrument panel.

Measurement Innovations Add Up to Big Savings for Semiconductors

January 8, 2008

A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will continue to have a

Photograph of the NIST micro microwave oven

Micro Microwave Does Pinpoint Cooking for Miniaturized Labs

November 8, 2007

Researchers at the National Institute of Standards and Technology (NIST) and George Mason University have demonstrated what is probably the world's smallest

NIST Presents Its Microfluidics Technologies For Commercial Adoption

October 12, 2007

A TECHNOLOGY TRANSFER AND FEDERAL MARKETPLACE EVENT NIST Presents Its Microfluidics Technologies For Commercial Adoption On Tuesday, October 9, 2007, NIST

illustration of NIST's modified field-effect transistor

New Quantum Dot Transistor Counts Individual Photons

October 11, 2007

A transistor containing quantum dots that can count individual photons (the smallest particles of light) has been designed and demonstrated at the National

NIST Laser-Based Method Cleans Up Grubby Nanotubes

December 21, 2006

Before carbon nanotubes can fulfill their promise as ultrastrong fibers, electrical wires in molecular devices, or hydrogen storage components for fuel cells

NIST Releases New Standard for Semiconductor Industry

October 12, 2006

A wide range of optical electronic devices, from laser disk players to traffic lights, may be improved in the future thanks to a small piece of semiconductor

Researchers Peg Magnetism as Key Driver of High-Temperature Superconductivity

July 6, 2006

GAITHERSBURG, Md.—When it comes to superconductivity, magnetic excitations may top good vibrations. Writing in the July 6, 2006, issue of Nature, scientists

Noise Measurement May Boost Cell Phone Performance

June 22, 2006

Researchers at the National Institute of Standards and Technology (NIST) and industry collaborators have developed improved methods for accurately measuring

Circuit Board Materials May Like It Hot (or Not)

June 8, 2006

Electrical circuits may act differently in Arizona than they do in Alaska—potentially affecting the performance of computers and other electronics. A new

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
---External & Government Affairs Division
----External & Government Affairs – HQ
---Investments Division
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---Operations Office
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---Risk Management Division
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---Strategy, Technology & Policy Division
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--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
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----Integration & Policy Office
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---External R&D Partnerships Division
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----National Advanced Packaging Manufacturing Program Group
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---Industrial Advisory Committee
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---Semiconductor Manufacturing Institute Division
----Semiconductor Manufacturing Institute – HQ
---Semiconductor Metrology & Characterization Office
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-Management Resources
--Management Resources
---Associate Director for Management Resources
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--Office of Information Systems Management
---Applications Systems Division
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---Research Services Office
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---Business Systems Division
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---Information Technology Security & Networking Division
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---Identity, Credential, and Access Management Division
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---Customer Access and Support Division
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---Infrastructure Services Division
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---Office of Information Systems Management
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---Innovation and Solutions Division
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---Human Resources Management Office
----Human Resources Management Office - HQ
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--Office of Safety, Health and Environment
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---Gaithersburg Safety, Health and Environment Division
----Safety and Health Group
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----Fire and Facilities Safety Group
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---Radiation Safety Division
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----Program Development and Compliance Group
----Radiation Safety - HQ
---Boulder Safety, Health and Environment Division
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--Office of Financial Resource Management
---Financial Systems and Reporting Division
----CBS Core Support Group
----CBS Feeder System Support Group
----Financial Systems and Reporting Division - HQ
----Financial Statements Group
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----Reconciliations Group
---Office of Financial Resource Management
----Office of Financial Resource Management - HQ
----Internal Controls Management & Evaluation Office
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---Finance Division
----Finance - HQ
----Financial Statements Group
----Data Control and Cost Execution Group
----Accounts Payable Purchase Orders, Grants & Foreign Payments
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----Travel Group
---Financial Operations Division
----Travel Group
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----Accounts Payable II Group
----Financial Operations - HQ
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---Budget Division
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----Budget - HQ
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-Laboratory Programs
--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
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----Guided Wave Electromagnetics Group
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----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
----Networked Control Systems Group
----Smart Connected Manufacturing Systems Group
----Smart Grid Group
----Transformational Networks and Services Group
---Spectrum Technology and Research Division
----Applied Systems Metrology Group
----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
----Radio Access and Propagation Metrology Group
----Wireless Networks Division - HQ
----Wireless Systems Innovation and Performance Group
---Public Safety Communications Research Division
----Public Safety Communications Research Division - HQ
----Advanced Communications Research Group
----Network Operations Group
---Communications Technology Laboratory HQ
----Communications Technology Laboratory HQ Gp
----Boulder Laboratory Director Office
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--Engineering Laboratory
---Building Energy and Environment Division
----Building Energy and Environment - HQ
----Mechanical Systems and Controls Group
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---Intelligent Systems Division
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----Manipulation and Mobility Systems Group
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---Materials and Structural Systems Division
----Earthquake Engineering Group
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----Materials and Structural Systems - HQ
----Polymeric Materials Group
----Structures Group
---Engineering Laboratory Office
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----Engineering Laboratory - HQ
----Engineering Laboratory Data, Security, Technology Group
---Fire Research Division
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----Engineered Fire Safety Group
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---Systems Integration Division
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----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
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----NICE
---Computer Security Division
----Computer Security - HQ
----Cryptographic Technology Group
----Secure Systems and Applications Group
----Security Components and Mechanisms Group
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---Applied and Computational Mathematics Division
----Mathematical Software Group
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----Computing and Communications Theory Group
----High Performance Computing and Visualization Group
----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
----Applied and Computational Statistics Group
----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---Software and Systems Division
----Systems Interoperability Group
----Software Quality Group
----Software and Systems - HQ
----Cyber Infrastructure Group
----Information Systems Group
---Information Access Division
----Information Access - HQ
----Image Group
----Multimodal Information Group
----Retrieval Group
----Visualization and Usability Group
---Information Technology Laboratory Office
----Office of Computational Science for Metrology
----Office of Emerging Technologies
----Office of IT Standardization
----Office of Government and Industrial Liaison
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Research Protections Office
----Research Protections Office - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
----Law Enforcement Standards Office
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Office of Data and Informatics
----Office of Data and Informatics - HQ
----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
----Sensor Science - HQ
----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
----Office of Weights and Measures
----Boulder Laboratory Director Office
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Policy and Strategy Division
----Analysis and Benchmarking Group
----Policy and Strategy – HQ
----Strategic Planning Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Diversity, Equity and Inclusivity Office
----Diversity, Equity and Inclusivity Office - HQ
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ