Harman, G.
(1996),
Wire Bonding to Multichip Modules and Other Soft Substrates, Multichip Modules with Integrated Sensors, Kluwer Academic Publishers,
(Accessed July 27, 2024)
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Wire Bonding to Multichip Modules and Other Soft Substrates, Multichip Modules with Integrated Sensors
Published
Author(s)
Citation
W. K. Jones and G. Harsanyi Eds.
Publisher Info
Kluwer Academic Publishers,
Pub Type
Books
Citation
Issues
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Created December 31, 1996, Updated February 17, 2017