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Keana C. K. Scott (Fed)

Physical Scientist, 643.02

Short Bio

Keana Scott is a Physical Scientist in the Materials Measurement Science Division at the National Institute of Standards and Technology (NIST).  Keana graduated from the California Institute of Technology in 1991 with a B.S. in Engineering and Applied Sciences. She completed her Ph.D. in Mechanical Engineering from the University of Pittsburgh in 1997 and earned an M.S. in Biotechnology from The Johns Hopkins University in 2006. After developing automation engineering solutions for Celera Genomics during their collaboration with NIH on the Human Genome Project, Keana led a group of scientists involved in computational chemistry and proteomics, while also contributing to informatics and genomics projects within both Celera and Applied Biosystems. Keana joined NIST in April 2006 as a member of the Materials Measurement Science Division to work on multi-modal bioimaging technique development and the microanalysis of biological materials using electron and ion beams. Keana's current work focuses on the characterization of release products from consumer products and the development of automated analytical approaches for optical, electron, and ion microscopy.

 

Employment

2006 – 2008, 2012 – 2018, 2020 - Present:  Physical Scientist, Materials Measurement Science Division, NIST

2008 – 2012, 2018 – 2020: Leader, Microscopy and Microanalysis Research Group, NIST

2006 - 2010: Sr. Scientific Advisor, Partner, Synaptic Science, LLC.

2002 - 2006: Manager, Informatics Dept., Celera Genomics

1997 - 2002: Sr. Automation Engineer, Data Science Automation

Publications

EDFAS FA TECHNOLOGY ROADMAP DIE-LEVEL ROADMAP COUNCIL (DLRC) POST-ISOLATION DOMAIN TECHNICAL REPORT - JAN 2023

Author(s)
Vinod Narang, Zhang Chuan, David Su, Phil Kaszuba, Steven Herschbein, Alan Street, Eckhard Langer, Martin von Haartman, Yu Zhu, Baohua Niu, Erwin Hendarto, Bryan Tracy, Jochonia Nxumalo, Rik Otte, Keana C. K. Scott
Semiconductor technologies are advancing at a rapid pace, with ongoing developments in logic and memory scaling, the introduction of new materials and
Created April 7, 2019, Updated May 2, 2023