Enright, L.
, Olszewska-Placha, M.
, Hill, M.
, Phommakesone, S.
, Kato, D.
, Hill, C.
, Kahari, H.
, Lee, C.
, Chen, C.
, Orloff, N.
, Celuch, M.
and Ray, U.
(2023),
Preparing for 6G: Developing best practices and standards for industrial measurements of low-loss dielectrics, 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, JP, [online], https://doi.org/10.23919/ICEP58572.2023.10129693, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936252
(Accessed August 13, 2024)