Harnessing Wrinkling Instabilities for Advanced Measurements of Polymeric Thin Films

Published

April 6, 2008

Author(s)

Jun Y. Chung, Rui Huang, Christopher Stafford

Abstract

Nanotechnology promises to revolutionize a growing set of materials applications ranging from electronics to drug delivery to ballistic protection. However, the quest to engineer materials on the nanoscale is met with the daunting task of measuring the physical and mechanical properties of these systems at these same length scales. For polymers, the challenge is even greater since conventional materials testing platforms lack the resolution for such soft systems. In this presentation, we will briefly review and discuss our current progress and advances in wrinkling metrology for characterizing physical, thermal, and mechanical properties of nanoscale polymeric materials.

Proceedings Title

American Chemical Society Division of Polymeric Materials: Science and Engineering| |Proceedings of the ACS Division of Polymeric Materials: Science & Engineering |ACS

Conference Dates

April 6-10, 2008

Conference Location

New Orleans, LA, US

Conference Title

American Chemical Society (Acs)

Pub Type

Conferences

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Keywords

light scattering, mechanical properties, metrology, polymer, residual stress, thermal, thin film, wrinkling

Citation

Chung, J. , Huang, R. and Stafford, C. (2008), Harnessing Wrinkling Instabilities for Advanced Measurements of Polymeric Thin Films, American Chemical Society Division of Polymeric Materials: Science and Engineering| |Proceedings of the ACS Division of Polymeric Materials: Science & Engineering |ACS, New Orleans, LA, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854497 (Accessed December 26, 2024)