Kopanski, J.
, Blackburn, D.
, Harman, G.
and Berning, D.
(1996),
Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits, Proc., IEEE Components, Packaging, and Manufacturing Technology Society, San Diego, CA, USA
(Accessed December 26, 2024)
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Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits
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Proceedings Title
Proc., IEEE Components, Packaging, and Manufacturing Technology Society
Conference Location
San Diego, CA, USA
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Conferences
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Created January 19, 1996, Updated October 12, 2021