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David A LaVan (Fed)
Program Manager
David A. LaVan is a Program Manager in the CHIPS National Advanced Packaging Manufacturing Program (NAPMP). Before joining CHIPS, he was a group leader in the Material Measurement Laboratory at NIST and has worked on the measurement of thermal and mechanical properties of thin films and devices for almost 30 years. He received his B.S. in Materials Science and Engineering from the University of Florida and his Ph.D. in Mechanical Engineering from the Johns Hopkins University; he was a Postdoctoral Fellow at Sandia National Labs and then in the joint MIT and Harvard HST Program. He was a Co-Chair for the 2018 Fall MRS Meeting and Chair for the 2023 NATAS Meeting. He was named to the National Academies Frontiers of Engineering in 2006 and awarded a Department of Commerce Bronze Medal in 2018.
Awards
- U.S. Department of Commerce Bronze Medal Award 2018
- Keck Futures Initiative on Synthetic Biology 2009
- U.S. National Academy of Engineering, Frontiers of Engineering, 2006
- Keck Futures Initiative on Nanoscience and Nanotechnology, 2004
- 'Spot' Recognition Award, Sandia National Laboratories, 1999
- First Place, Society for Experimental Mechanics Student Paper Competition, 1997