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Yaw S. Obeng (Fed)

Research Chemist

Yaw Obeng has been at NIST since 2007, with extensive experience from the microelectronic industry. He conducts research into new measurement techniques of assessing reliability in electronic materials and emerging nano-electronic devices, with special interest in the interconnects and advanced packaging. He is also interested in supply chain integrity, especially in counterfeit electronics mitigation. He serves as subject matter expert and technical leader in international standards development, and international semiconductor technology roadmaps development.

Obeng previously worked with AT&T Bell Laboratories, Lucent Technologies, Agere Systems and Texas Instruments. He has also co-founded two start-up companies (psiloQuest, Inc and Nkanea Technologies, Inc.) dedicated to the development of novel materials for semiconductor and optoelectronics fabrication. He is an inventor on over 50 U.S. and international patents, and has published over 150 papers in various technical publications. Dr. Obeng has a passion for mentoring; he has served on numerous graduate student dissertation committees. He currently holds an adjunct Professorship at Clemson University. He is a Fellow of the Royal Society of Chemistry, UK, Fellow of the American institute of Chemists and Senior Member of IEEE.

Publications

Patents (2018-Present)

System And Method For Monitoring Ultraviolet Radiation Bioremediation

NIST Inventors
Yaw S. Obeng
Healthcare-associated infections (HAIs) impose great burdens on public health; they are probably some of the toughest and the most pressing healthcare problems in acute-care hospitalization. Ultraviolet-C illumination effectively decontaminate surfaces to reduce the population of many HAI-inducing
Image of 2 security officers inspecting packages

Authentication Article and Process for Making Same

NIST Inventors
Yaw S. Obeng and Joseph J. Kopanski
An authentication article includes: a substrate including: a first surface; a second surface disposed laterally to the first surface and at a depth below the first surface; and a plurality of indentations including the depth at the second surface of the substrate; and an array disposed on the
Created September 10, 2019, Updated May 17, 2024