Adams, V.
, Joshi, Y.
and Blackburn, D.
(1997),
Application of Compact Model Methodologies to Natural Convection Cooling of an Array of Electronic Packages in a Low Profile Enclosure, Proc., ASME International Intersociety Electronic and Photonic Packaging Conference, Kohala, HI, USA
(Accessed July 27, 2024)
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Application of Compact Model Methodologies to Natural Convection Cooling of an Array of Electronic Packages in a Low Profile Enclosure
Published
Author(s)
V. H. Adams, ,
Proceedings Title
Proc., ASME International Intersociety Electronic and Photonic Packaging Conference
Issue
158
Conference Dates
June 15-19, 1997
Conference Location
Kohala, HI, USA
Pub Type
Conferences
Citation
Issues
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Created May 31, 1997, Updated October 12, 2021